Chip Industry Week In Review


The U.S. Department of Commerce and Texas Instruments (TI) signed a non-binding preliminary memorandum of terms to provide up to $1.6 billion in CHIPS Act funding towards TI’s investment of over $18 billion for three 300mm semiconductor wafer fabs under construction in Texas and Utah. TI also expects to get about $6 billion to $8 billion from the U.S. Department of Treasury’s Investmen... » read more

Research Bits: Nov. 7


ADC side-channel attacks Researchers at MIT propose two ways to protect analog-to-digital converters (ADCs) from power and electromagnetic side-channel attacks. The researchers first investigated the side-channel attacks that could be used against ADCs. Power attacks usually involve an attacker soldering a resistor onto the device’s circuit board to measure its power usage. An electromagn... » read more

Spin–orbit torque engineering in β-W/CoFeB heterostructures with W–Ta or W–V alloy layers between β-W and CoFeB


Abstract "The spin–orbit torque (SOT) resulting from a spin current generated in a nonmagnetic transition metal layer offers a promising magnetization switching mechanism for spintronic devices. To fully exploit this mechanism, in practice, materials with high SOT efficiencies are indispensable. Moreover, new materials need to be compatible with semiconductor processing. This study introduce... » read more