Power Semiconductors: A Deep Dive Into Materials, Manufacturing & Business

By The SE Staff - 03 Apr, 2023 - Comments: 0

Whether you’re the owner of the average smartphone, commuting on trains, or driving around in a Tesla, you use power semiconductor devices every day. In a technology-dependent world, these devices are everywhere, and demand for more types of chips using different materials is growing. In the past, most engineers paid little attention to power semiconductors. They were deemed commodity, off... » read more

Gearing Up For Next-Gen Power Semis

By Mark LaPedus - 16 Sep, 2021 - Comments: 0

After years in R&D, several vendors are moving closer to shipping power semiconductors and other products based on next-generation wide-bandgap technologies. These devices leverage the properties of new materials, such as aluminum nitride, diamond, and gallium oxide, and they are also utilized in different structures, such as vertical gallium-nitride power devices. But while many of thes... » read more

Manufacturing Bits: May 25

By Mark LaPedus - 25 May, 2021 - Comments: 0

Higher voltage GaN Imec and Aixtron have demonstrated the ability to extend gallium-nitride (GaN) to new voltage levels in the power semiconductor market, enabling the technology to compete in much broader segments. Imec and Aixtron have demonstrated epitaxial growth of GaN buffer layers qualified for 1,200-volt applications on specialized 200mm substrates with a hard breakdown exceeding 1,... » read more

Manufacturing Bits: Nov. 21

By Mark LaPedus - 21 Nov, 2017 - Comments: 0

Germanium-on-mica Germanium is an element that can be used in various applications in electronics, such as optoelectronics, semiconductors and others. For example, silicon-germanium (SiGe), an alloy of silicon and germanium, is used for making RF chips. In future finFET transistors, some are exploring the idea of using pure germanium for the PFET structure to boost the electron mobility in ... » read more

Manufacturing Bits: Nov. 14

By Mark LaPedus - 14 Nov, 2017 - Comments: 0

GaN for electric cars Leti is coordinating a new European project to improve the drivetrain in electric vehicles. The so-called ModulED project will focus on the development of gallium nitride (GaN) technology for electric vehicles. The goal is to use power-based GaN devices for the motor, enabling a change from direct current to alternating current. The three-year, €7.2 million proje... » read more

Manufacturing Bits: April 21

By Mark LaPedus - 21 Apr, 2015 - Comments: 0

Fan-out packaging consortium A*STAR’s Institute of Microelectronics (IME) and others have formed a high-density fan-out wafer level packaging (FOWLP) consortium in Singapore. Others in the group include Amkor, Nanium, STATS ChipPAC, NXP, GlobalFoundries, Kulicke & Soffa, Applied Materials, Dipsol Chemicals, JSR, KLA-Tencor, Kingyoup Optronics, Orbotech and Tokyo Ohka Kogyo (TOK). T... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer