Money Pours Into New Fabs And Facilities


Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

Week In Review: Semiconductor Manufacturing, Test


TECHCET is forecasting semiconductor precursor revenues, both for high-ƙ metal dielectrics and low-ƙ dielectrics, will increase in the second half of 2023, rebounding from the current zero percent growth rate. Wafer start volumes are expected to rebound in 2024 with expansions in 2nm and 3nm logic devices. SEMI also predicts the global slump in semiconductor sales will end this quarter, gi... » read more

Week In Review: Semiconductor Manufacturing, Test


South Korea slashed chip production in February by 17.7% compared to the previous month — 41.8% year-over-year, and the sharpest drop since 2008 — according to figures from South Korea’s National Statistics Office. Inventories were up 33.5%, while exports dropped by 41.6%. China launched a security probe into U.S. memory chipmaker Micron in apparent retaliation for U.S. restrictions on... » read more

Week In Review: Manufacturing, Test


The U.S. is aiming for the creation of two new advanced semiconductor manufacturing facilities with “a robust supplier ecosystem” supported by the $52.7 billion CHIPS Act. Included is an $11 billion investment in semiconductor research and development, along with the creation of a new public-private partnership called the National Semiconductor Technology Center. This follows more than a do... » read more

Week In Review: Manufacturing, Test


Onshoring and the supply chain Efforts to patch up supply chain weaknesses by moving more manufacturing onshore in the United States and Europe are generating a lot of buzz. Morris Chang, TMSC's founder, described those moves as "a very expensive exercise in futility," during an interview with the Brookings Institution and Center for Strategic and International Studies, adding that it is like... » read more

Week In Review: Design, Low Power


Nvidia again made its case for acquiring Arm to the UK's Competition and Markets Authority (CMA). “Arm is a private for-profit business at a crossroads. After acquiring Arm several years ago, SoftBank increased Arm’s headcount, hoping to spur long-term growth in several markets, including data center and personal computer, long dominated by Intel and x86. SoftBank’s investment phase has c... » read more

Week In Review: Auto, Security, Pervasive Computing


Security Kyocera is using Rambus’ RT-130 Root of Trust and AES-IP-38 AES Accelerator IP for data security on Kyocera Evolution Series MFPs (multi-function printers). Connected printers are notorious targets for malicious actors to gain access a network or data. The Evolution Series MFPs’ data security mets Federal Information Processing Standards (FIPS) 140-2 Cryptographic Module Validatio... » read more

Week In Review: Manufacturing, Test


Chipmakers Apple has introduced its latest MacBook Pro notebooks built around the company’s new, in-house designed processors, dubbed the M1 Pro and M1 Max. The chips, to be incorporated in its 14- and 16-inch MacBook Pro systems, are the most powerful devices developed by Apple. The CPUs in the M1 Pro and M1 Max chips deliver up to 70% faster performance than the first M1 device. Based ... » read more

Week In Review: Manufacturing, Test


Government and trade The U.S. Bureau of Industry and Security (BIS) has expanded its export control regulations for U.S.-based hi-tech companies. The BIS has added more companies to its “Military End User” (MEU) list. The list involves 103 entities, which includes 58 Chinese and 45 Russian companies. The U.S. government has determined that these companies are “military end users” or th... » read more

Week In Review: Design, Low Power


Tools & IP Cadence debuted System-Level Verification IP (System VIP), a suite of tools and libraries for automating SoC testbench assembly, bus and CPU traffic generation, cache-coherency validation, and system performance bottleneck analysis. Tests created using the System VIP solution are portable across Cadence simulation, emulation and prototyping engines and can also be extended to po... » read more

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