Manufacturing Bits: June 26

By Mark LaPedus - 26 Jun, 2018 - Comments: 0

Gummy bear chips The Technical University of Munich (TUM) and Forschungszentrum Jülich have developed a 3D inkjet printing technique to print electrodes on several soft substrates, including gummy bears. The main application is to develop a new class of sensor-based implants for life sciences. For this application, electrodes or microelectrode arrays (MEAs) are developed and printed on sof... » read more

SOS Collaboration Platform: Powering The Next Discoveries In Physics

By Ranjit Adhikary - 03 Aug, 2017 - Comments: 0

The world is on the cusp of some of the greatest scientific breakthroughs in human history. The experiments physicists are carrying out today will shed new light on how our universe works. The Large Hadron Collider (LHC), a $10 billion project, unleashed a new perspective of how our universe works by letting us take a look at how tiny particles interact. You can forgive the physicists workin... » read more

Manufacturing Bits: Feb. 14

By Mark LaPedus - 14 Feb, 2017 - Comments: 0

Making quark soup CERN, the European Organization for Nuclear Research, recently presented its latest results on quark-gluon plasma, or quark soup, a state of matter that supposedly existed during the early formation of the universe. For this, CERN used the Large Hadron Collider (LHC), the world’s most powerful particle accelerator. The LHC is situated in a tunnel 100 meters underground ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Large Hadron Collider

Manufacturing Bits: June 26

SOS Collaboration Platform: Powering The Next Discoveries In Physics

Manufacturing Bits: Feb. 14