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Inside Panel-Level Fan-Out Technology


Semiconductor Engineering sat down to discuss panel-level fan-out packaging technology with Tanja Braun, deputy group manager at the Fraunhofer Institute for Reliability and Microintegration IZM, and Michael Töpper, business development manager at Fraunhofer IZM. Braun is responsible for the Panel Level Packaging Consortium at Fraunhofer IZM, as well as the group manager for assembly and encap... » read more

Challenges For Future Fan-Outs


The fan-out wafer-level packaging market is heating up. At the high end, for example, several packaging houses are developing new fan-out packages that could reach a new milestone and hit or break the magic 1µm line/space barrier. But the technology presents some challenges, as it may require more expensive process flows and equipment like lithography. Fig. 1: Redistribution layers. Source: L... » read more