Manufacturing Bits: March 29

By Mark LaPedus - 29 Mar, 2016 - Comments: 0

Brain-inspired computing Lawrence Livermore National Laboratory (LLNL) has purchased a brain-inspired supercomputing platform for deep learning developed by IBM Research. Based on a neurosynaptic computer chip called IBM TrueNorth, the scalable platform will process the equivalent of 16 million neurons and 4 billion synapses. It will consume the energy equivalent of a tablet computer. ... » read more

Manufacturing Bits: June 23

By Mark LaPedus - 23 Jun, 2015 - Comments: 0

Diamond shock waves For years, the industry has been exploring the use of diamonds for electronics applications. Diamonds could be used to reduce heat in electronic systems. In addition, diamond FETs are also intriguing. Diamond has a wide bandgap (5.45 eV), a high breakdown field (10MV/cm), and high thermal conductivity (22W/cmK). But it could take years before diamond FETs reach the mains... » read more

Manufacturing Bits: May 26

By Mark LaPedus - 26 May, 2015 - Comments: 0

Table-top EUV Swinburne University of Technology has developed a table-top extreme ultraviolet (EUV) laser power source. The source could be used to develop a system for use in metrology and other applications. The table-top setup is a new way to generate bright beams of coherent EUV radiation. It may offer a cost-effective alternative to large-scale facilities, such as synchrotrons or free... » read more

Manufacturing Bits: May 5

By Mark LaPedus - 05 May, 2015 - Comments: 0

Transparent armor The U.S. Naval Research Laboratory (NRL) has developed transparent armor. The technology is actually a hard transparent ceramic, based on a material called spinel. Spinel is a magnesium aluminate compound. Spinel is also a gemstone, which could come in various colors. NRL has devised a fabrication process to create the technology, which is harder and superior to glass, sap... » read more

Manufacturing Bits: Feb. 17

By Mark LaPedus - 17 Feb, 2015 - Comments: 0

Swedish nano Sweden’s Lund University plans to build a pilot production facility for startups in the field of nanotechnology. The facility would be used for Swedish companies and researchers to build products. This is for companies who do not have the funds to build their own facilities or buy expensive equipment. The project originates from the successful research into nanowires at Lund ... » read more

Manufacturing Bits: Sept. 16

By Mark LaPedus - 16 Sep, 2014 - Comments: 0

Making sounds with atoms What is the sound of one hand clapping? Perhaps a better question is what is the sound of an atom? Chalmers University of Technology has demonstrated the ability to make a sound with an atom. More specifically, researchers have made acoustic waves with an artificial atom. In doing so, researchers have demonstrated quantum physics with sound taking on the role of lig... » read more

Manufacturing Bits: April 1

By Mark LaPedus - 01 Apr, 2014 - Comments: 0

Portable laser weapons For years, the U.S. military has been developing high-energy laser (HEL) weapons. But the massive size, weight and power requirements of laser systems limit their use on many military platforms. The Defense Advanced Research Projects Agency (DARPA) has made a breakthrough in its so-called Excalibur program. The program will develop laser weapons that are 10 times ligh... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer