Manufacturing Bits: Feb. 23

By Mark LaPedus - 23 Feb, 2016 - Comments: 1

EUV resist venture JSR and Imec have signed a deal to form a joint venture to develop resists for extreme ultraviolet (EUV) lithography. The new company, dubbed EUV Resist Manufacturing & Qualification Center NV, is incorporated with a majority of the total shares held by JSR Micro NV. As EUV technology advances, the IC industry is putting pressure on materials suppliers and other vendo... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 13 Feb, 2015 - Comments: 0

First Solar announced that Apple has committed $848 million for clean energy from First Solar’s California Flats Solar Project in Monterey County, Calif. Apple will receive electricity from 130 megawatts (MW) AC of the solar project under a 25-year power purchase agreement (PPA), the largest agreement in the industry to provide clean energy to a commercial end user. Applied Materials repor... » read more

Manufacturing Bits: Sept. 2

By Mark LaPedus - 02 Sep, 2014 - Comments: 0

Looking at space dust The first analysis of space dust, collected by a special collector onboard NASA's Stardust mission and sent back to Earth for study in 2006, is more complex in composition and structure than previously thought. Researchers examined the dust using synchrotron light sources from three groups--the U.S. Department of Energy's Argonne National Laboratory, Lawrence Berkeley... » read more

Manufacturing Bits: Aug. 26

By Mark LaPedus - 26 Aug, 2014 - Comments: 0

Smokestack metrology The National Institute of Standards and Technology (NIST) has nearly completed the construction of one of the world's more unusual measurement systems. The organization is devising a 50-meter horizontal smokestack at its campus in Gaithersburg, Md. The new facility will accurately determine the amount of gases discharged from smokestacks at coal-fired power plants and o... » read more

Manufacturing Bits: June 17

By Mark LaPedus - 17 Jun, 2014 - Comments: 1

PiezoFET debuts The University of Twente MESA+ Research Institute and SolMateS have put a new twist on the finFET. A piezoelectric stressor layer has been deposited around the finFET, thereby enabling what researchers call the PiezoFET. The PiezoFET could enable steep sub-threshold slope devices. In the lab, this device was also able to reduce the leakage by a factor of five. [caption id... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Lawrence Berkeley

Manufacturing Bits: Feb. 23

The Week In Review: Manufacturing

Manufacturing Bits: Sept. 2

Manufacturing Bits: Aug. 26

Manufacturing Bits: June 17

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