Why An IBM Sale Matters

By Ed Sperling - 07 Jul, 2014 - Comments: 0

The rumored sale of IBM’s semiconductor unit to GlobalFoundries could add some interesting capabilities for the foundry, including deep process technology and expertise. It also could have some far-reaching effects for the entire semiconductor industry. The reason revolves around ongoing U.S. government initiatives to improve visibility for components throughout its supply chain. IBM has b... » read more

The Week In Review: System-Level Design

By Ed Sperling - 24 Jan, 2014 - Comments: 0

India's reliance on technology has created a huge demand for software in the country. IDC expects the market for enterprise software in India to grow 19%, and the market for collaborative applications to grow 13.5%. Growth is continuing across all business markets, turning India into a huge consumer of software rather than just a creator. The enterprise software market in India is dominated by ... » read more

The Changing Role Of The OSAT

By Ed Sperling - 31 Jul, 2012 - Comments: 0

By Ann Steffora Mutschler As process geometries and packaging technologies have matured over time, the OSAT (outsourced semiconductor assembly and test) provider has played an evolving role in the semiconductor packaging ecosystem. With true 3D chip stacking on the horizon, their role may evolve once again as ecosystem players jostle for position in the 3D universe. There are two things tha... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Lenovo

Why An IBM Sale Matters

The Week In Review: System-Level Design

The Changing Role Of The OSAT