Week In Review: Design, Low Power

By Jesse Allen - 14 Jan, 2022 - Comments: 0

Nvidia again made its case for acquiring Arm to the UK's Competition and Markets Authority (CMA). “Arm is a private for-profit business at a crossroads. After acquiring Arm several years ago, SoftBank increased Arm’s headcount, hoping to spur long-term growth in several markets, including data center and personal computer, long dominated by Intel and x86. SoftBank’s investment phase has c... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 14 Jan, 2022 - Comments: 0

Security Kyocera is using Rambus’ RT-130 Root of Trust and AES-IP-38 AES Accelerator IP for data security on Kyocera Evolution Series MFPs (multi-function printers). Connected printers are notorious targets for malicious actors to gain access a network or data. The Evolution Series MFPs’ data security mets Federal Information Processing Standards (FIPS) 140-2 Cryptographic Module Validatio... » read more

Watching Qubits At Work

By Katherine Derbyshire - 18 Aug, 2014 - Comments: 0

As previously discussed, part of the appeal of qubits based on nitrogen-vacancy (N-V) defect centers in diamond is the ability to manipulate them with light. Light pulses can be used both to initialize the qubit array and to measure the results of quantum computations. As recent work at The University of Chicago shows, light can also be used to study the evolution of the quantum state in the... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: light

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Watching Qubits At Work