Power/Performance Bits: Sept. 14


Thermal management material Engineers at the University of California Los Angeles integrated a new thermal management material, boron arsenide, with a HEMT chip to demonstrate the material's potential. The team developed boron arsenide as a thermal management material in 2018 and found it to be very effective at drawing and dissipating heat. In the latest experiments, they used wide band... » read more

Power/Performance Bits: June 22


Terahertz silicon multiplexer Researchers from Osaka University and University of Adelaide designed a silicon multiplexer for terahertz-range communications in the 300-GHz band. “In order to control the great spectral bandwidth of terahertz waves, a multiplexer, which is used to split and join signals, is critical for dividing the information into manageable chunks that can be more easily... » read more

Power/Performance Bits: April 28


Flat microwave reflector Researchers from Los Alamos National Laboratory developed a new flat reflector for microwaves that could improve communications while providing a better form factor. It also breaks reciprocity, effectively turning it into a one-way mirror. The flat reflector can be reconfigured on the fly electronically, allowing it to be used for beam steering, customized focusing,... » read more

Power/Performance Bits: April 14


Undoped polymer ink Researchers at Linköping University, Chalmers University of Technology, University of Washington, University of Cologne, Chiba University, and Yunnan University developed an organic ink for printable electronics that doesn't need to be doped for good conductivity. "We normally dope our organic polymers to improve their conductivity and the device performance. The proces... » read more

Power/Performance Bits: June 4


Flexible high-temp dielectric Researchers at Rice University, Georgia Institute of Technology, and Cornell University developed a new high-temperature dielectric nanocomposite for flexible electronics, energy storage, and electric devices that combines one-dimensional polymer nanofibers and two-dimensional boron nitride nanosheets. The polymer nanofibers act as a structural reinforcement, w... » read more

Power/Performance Bits: April 2


DNA programming Computer scientists at California Institute of Technology, University of California, Davis, Maynooth University, and Harvard University created a library of DNA molecules that can self-assemble to compute a variety of algorithms. Each molecule represents a six-bit binary number. The library created by the team is made up of around 700 short pieces, or tiles, of DNA. Each DNA... » read more

Power/Performance Bits: Apr. 10


Lithium-air battery Researchers at the University of Illinois at Chicago and Argonne National Laboratory designed a new lithium-air battery that works in a natural air environment and still functioned after 750 charge/discharge cycles, a record for this battery type. In theory, lithium-air batteries work by combining lithium present in the anode with oxygen from the air to produce lithium p... » read more

Power/Performance Bits: March 7


Supercapacitor plants Scientists at Linköping University in Sweden developed a method for transforming roses into supercapacitors that can be charged and discharged hundreds of times. The team created a solution that, when fed through the cut end of the stem, polymerizes inside the rose's vascular system with the plant's own biochemical response mechanism acting as catalyst, creating lon... » read more

Power/Performance Bits: Dec. 8


Reducing transistor switching power One of the great challenges in electronics has been to reduce power consumption during transistor switching operation. However, engineers at University of California, Santa Barbara, and Rice University demonstrated a new transistor that switches at only 0.1 volts and reduces power dissipation by over 90% compared to state-of-the-art MOSFETs. "The steepn... » read more

Manufacturing Bits: Dec. 1


European R&D hub A new European hub for semiconductor R&D is open for business. The hub is part of an EU-funded program called ASCENT or Access to European Nanoelectronics Network. The program is aimed to give researchers access to chip and related technologies within three European R&D organizations--CEA-Leti, Imec and the Tyndall National Institute. As reported, ASCENT was originally f... » read more

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