Electronics Supply-Chain Trust Standards Emerge

By Bryon Moyer - 07 Jan, 2021 - Comments: 0

Creative new ideas for electronics supply-chain trust are in rich supply, whether securing identity, protecting logistics, or establishing provenance. But underlying these efforts are wide-ranging standards in development from a broad set of organizations. Today, no one-stop-shop for supply-chain standards exists. Instead, there is huge fragmentation. It can be difficult to identify all of t... » read more

March’19 Startup Funding: Money Springs Forth

By Jeff Dorsch - 04 Apr, 2019 - Comments: 0

Another month, another couple of billion-dollar rounds. Singapore-based Grab raised nearly $1.5 billion from the SoftBank Vision Fund, bringing its total private funding to more than $4.5 billion and valuing the company at around $14 billion. Grab has acquired Uber’s ride-hailing business in Southeast Asia and now competes chiefly with Go-Jek of Indonesia in Thailand and other emerging mar... » read more

AI: The Next Big Thing

By Ed Sperling - 15 Mar, 2018 - Comments: 2

The next big thing isn't actually a thing. It's a set of finely tuned statistical models. But developing, optimizing and utilizing those models, which collectively fit under the umbrella of artificial intelligence, will require some of the most advanced semiconductors ever developed. The demand for artificial intelligence is almost ubiquitous. As with all "next big things," it is a horizonta... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: logistics

Electronics Supply-Chain Trust Standards Emerge

March’19 Startup Funding: Money Springs Forth

AI: The Next Big Thing