What Exactly Are Chiplets And Heterogeneous Integration?
New technologies drive new terminology, but the early days for those new approaches can be very confusing.
Startup Funding: Q1 2025
AI chips and data center communications see big funding; 75 startups raise $2 billion.
Chip Industry Week In Review
ASML-imec deal; Intel Foundry's future; European tech consortium; photonics-related acquisitions; global chip market up; new security IP and algorithms; neuromorphic AI chip; adaptive MCUs; auto superbrains.
Chip Industry Week In Review
Agentic AI chip design; $6.5B AI acquisition; IC energy consumption and emissions; US allies export controls; CPO switches; foundry and IC design house revenue reports; side-channel analysis library; 12-layer HBM4; 3D GAA utilizing 2D semis; EV charging in 5 minutes.
Chiplets Add New Power Issues
Well-understood challenges become much more complicated when SoCs are disaggregated.
Global IC Fabs And Facilities Report: 2024
Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form hubs with friendly nations.
Is In-Memory Compute Still Alive?
It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second chance.
Baby Steps Toward 3D DRAM
Stacking layers means a complete architecture rethink.
EUV’s Future Looks Even Brighter
Demand for AI chips is growing exponentially, but costs and complexity limit the technology to a handful of companies. That could soon change.
Linear Pluggable Optics Save Energy In Data Centers
New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.
Chip Architectures Becoming Much More Complex With Chiplets
Options for how to build systems increase, but so do integration issues.
