The IC industry is making a giant leap from planar devices to a range of next-generation architectures, such as 3D NAND and finFETs. But it’s taking longer than expected to ramp up these new technologies in the market. And the challenges are expected to mount for the next round of chips.
It’s difficult to pinpoint the exact issues with 3D NAND and finFETs. On the manufacturing front alo...
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