tag: Massachusetts Institute of Technology

Thermally Aware Chiplet Placement Algorithm Based on Automatic Differentiation (MIT, IBM)
By Technical Paper Link - 07 Mar, 2025 - Comments: 0

A new technical paper titled "DiffChip: Thermally Aware Chip Placement with Automatic Differentiation" was published by researchers at MIT and IBM. Abstract "Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads to significant thermal management challenges, requiring ... » read more

Research Bits: Mar. 4
By Jesse Allen - 04 Mar, 2025 - Comments: 0

Fiber computer Researchers from Massachusetts Institute of Technology (MIT), Rhode Island School of Design, and Brown University developed a programmable elastic fiber computer that could be woven into clothing to monitor health conditions and physical activity. Clothing created using the fiber computer was reported as comfortable and machine washable. The single elastic fiber computer cont... » read more

SW-HW Co-Design Mitigation To Strengthen ASLR Against Microarchitectural Attacks (MIT)
By Technical Paper Link - 26 Feb, 2025 - Comments: 0

A technical paper titled "Oreo: Protecting ASLR Against Microarchitectural Attacks" was published by researchers at MIT. Abstract "Address Space Layout Randomization (ASLR) is one of the most prominently deployed mitigations against memory corruption attacks. ASLR randomly shuffles program virtual addresses to prevent attackers from knowing the location of program contents in memory. Microa... » read more

Research Bits: Jan. 13
By Jesse Allen - 13 Jan, 2025 - Comments: 0

High-temp electrochemical memory Researchers from the University of Michigan and Sandia National Laboratory propose a nonvolatile electrochemical memory that can store and rewrite information at temperatures over 1100°F (600°C), enabling it to continue working in environments as extreme as the surface of Venus. Instead of transporting electrons, the memory moves oxygen ions between layere... » read more

Research Bits: Dec. 24
By Jesse Allen - 24 Dec, 2024 - Comments: 0

Growing multilayered chips Researchers from MIT, Samsung Advanced Institute of Technology, Sungkyunkwan University, and University of Texas at Dallas developed a method to fabricate a multilayered chip with alternating layers of semiconducting material grown directly on top of each other. The approach enables high-performance transistors and memory and logic elements on any random crystalline ... » read more

Research Bits: Dec. 11
By Jesse Allen - 11 Dec, 2024 - Comments: 0

Photonic AI processor Researchers from Massachusetts Institute of Technology (MIT), Enosemi, and Periplous developed a fully integrated photonic processor that can perform all the key computations of a deep neural network optically on the chip. The chip is fabricated using commercial foundry processes and uses three layers of devices that perform linear and nonlinear operations. A particula... » read more

Research Bits: Dec. 3
By Jesse Allen - 03 Dec, 2024 - Comments: 0

Self-assembly of mixed-metal oxide arrays Researchers from North Carolina State University and Iowa State University demonstrated a technique for self-assembling electronic devices. The proof-of-concept work was used to create diodes and transistors with high yield and could be used for more complex electronic devices. “Our self-assembling approach is significantly faster and less expensi... » read more

Research Bits: Nov. 25
By Jesse Allen - 25 Nov, 2024 - Comments: 0

3D-printed ESD protection Researchers from Lawrence Livermore National Laboratory developed a printable elastomeric silicone foam for electronics packaging that provides both mechanical and electrostatic discharge (ESD) protection. The team used a 3D printing technique called direct ink writing (DIW), an extrusion process in which a paste with controlled rheological properties such as elast... » read more

Research Bits: June 18
By Jesse Allen - 18 Jun, 2024 - Comments: 0

Gallium nitride can take the heat Researchers from Massachusetts Institute of Technology (MIT), the UAE's Technology Innovation Institute, Ohio State University, Rice University, and Bangladesh University of Engineering and Technology investigated the performance of ohmic contacts in a gallium nitride (GaN) device at extremely high temperatures, such as those that would be required for devices... » read more

Research Bits: June 4
By Jesse Allen - 04 Jun, 2024 - Comments: 0

Ultra-pure silicon Researchers from the University of Manchester and University of Melbourne developed a technique to engineer ultra-pure silicon that could be used in the construction of high-performance qubit devices that extend quantum coherence times. The highly purified silicon chips house and protect the qubits so they can sustain quantum coherence much longer, enabling complex calcul... » read more

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