Week in Review: IoT, Security, Auto


Internet of Things Gartner identified what it says are the top 10 strategic Internet of Things technologies and trends. Number one, no surprise, is artificial intelligence. Nick Jones, research vice president at Gartner, said in a statement, “AI will be applied to a wide range of IoT information, including video, still images, speech, network traffic activity, and sensor data.” Other top t... » read more

Week in Review: IoT, Security, Auto


Deals Dialog Semiconductor made a blockbuster deal with Apple – the chip company will license power management technologies and transfer some assets to Apple, which will use them in their internal chip research and development. More than 300 Dialog employees, mostly engineers, will join Apple, which will pay $300 million in cash for the transaction and prepay another $300 million for Dialog ... » read more

Week in Review: IoT, Security, Auto


Internet of Things Amazon Web Services announced that Iridium Communications has joined the AWS Partner Network. AWS and Iridium have collaborated on development of Iridium CloudConnect, a service that enables worldwide coverage for Internet of Things applications through Iridium’s satellite network. AWS IoT is being paired with Iridium IoT services as a result. IHS Markit forecasts there wi... » read more

Manufacturing Bits: Jan. 9


Two-photon lithography Lawrence Livermore National Laboratory (LLNL) has extended the capabilities of a high-resolution 3D printing technique called two-photon lithography (TPL). TPL enables the development of 3D-printed objects. LLNL’s technology could enable 3D-printed embedded structures inside the body, such as stents, joint replacements or bone scaffolds. It could also one day be ... » read more

The Week in Review: IoT


Products/Services NXP Semiconductors is partnering with Alibaba Cloud, the cloud computing business unit of Alibaba Group, to develop secure smart devices for edge computing. The companies will also work together on Internet of Things offerings. AliOS, the Alibaba IoT operating system, has been integrated with NXP’s application processors, microcontrollers, and Layerscape multicore processor... » read more

Manufacturing Bits: June 13


FeFET biz heats up The ferroelectric FET (FeFET) market is heating up. One company, Ferroelectric Memory Co. (FMC), has been developing FeFETs, a new memory type for use in standalone and embedded applications. Now, Imec is also developing FeFETs in both planar and vertical varieties. [caption id="attachment_147967" align="alignleft" width="239"] Imec's FeFET (Source: Imec)[/caption] ... » read more

Manufacturing Bits: March 21


Making harder windows Using cubic silicon nitride materials, a team of researchers have developed a harder window that can sustain severe conditions. There is a demand for harder and stronger windows in various applications, such as engines, ball bearings, cutting tools and other others. To enable this technology, researchers used materials based on transparent polycrystalline ceramics. One... » read more

Manufacturing Bits: Jan. 10


Atom interferometers The Massachusetts Institute of Technology (MIT) has devised one of the world’s most accurate atom interferometers. Interferometry is a common measurement technique. Basically, the technology looks at electromagnetic waves. The waves are superimposed to extract information. One interferometry technology type, called an atom interferometer, utilizes the waves of ato... » read more

The Week In Review: IoT


Management Intel has hired Tom Lantzsch, the executive vice president of strategy at ARM Holdings, to serve as senior vice president and general manager of its IoT Group, effective in January. Lantzsch succeeds Douglas Davis, a senior vice president who was running the IoT Group and had announced plans to retire from Intel after more than 30 years. Davis reconsidered that move, however; he wil... » read more

Manufacturing Bits: Nov. 29


Supersonic kinetic spraying Low-cost flexible electronics could enable a new class of products, such as roll-up displays, wearable electronics, flexible solar cells and electronic skin. There is a major barrier to enable these technologies, however. The problem is to make flexible transparent conducting films that are scalable and economical. The University of Illinois at Chicago and Kor... » read more

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