Manufacturing Bits: Feb. 26


Vitamin C chips Using vitamin C, Rice University has developed a process that turns gold nanorods into small gold nanowires. Nanorods are a type of structure, while nanowires are simply tiny wires. With the technology, Rice is able to produce nanowires with various lengths. These can be used in electronics as well as light-manipulating applications like plasmons. A “plasmon is a quantum o... » read more

System Bits: Feb. 19


Eco-friendly material for wireless IoT sensors Researchers at Canada’s Simon Fraser University and in Switzerland collaborated on developing a wood-derived cellulose material that could be used in a 3D printer, instead of the customary plastic and polymeric materials for electronics. With 3D printing, the material can offer flexibility to add or embed functions onto 3D shapes or fabrics, the... » read more

System Bits: Feb. 11


Modeling computer vision on human vision University of Michigan scientists used digital foveation technology to render images that are more comprehensible to machine vision systems, while also reducing energy consumption by 80%. The effect is achieved by manipulating a camera’s firmware. “It'll make new things and things that were infeasible before, practical,” Professor Robert Dick s... » read more

System Bits: Dec. 18


AI studies at Stanford Language processing is a leading area in artificial intelligence research, Stanford University reports. “We’re trying to inform the conversation about artificial intelligence with hard data,” says Yoav Shoham, professor of computer science, emeritus, adding, “Language is the ultimate frontier of AI research because you can express any thought or idea in langua... » read more

Week in Review: IoT, Security, Auto


Internet of Things Gartner identified what it says are the top 10 strategic Internet of Things technologies and trends. Number one, no surprise, is artificial intelligence. Nick Jones, research vice president at Gartner, said in a statement, “AI will be applied to a wide range of IoT information, including video, still images, speech, network traffic activity, and sensor data.” Other top t... » read more

Week in Review: IoT, Security, Auto


Deals Dialog Semiconductor made a blockbuster deal with Apple – the chip company will license power management technologies and transfer some assets to Apple, which will use them in their internal chip research and development. More than 300 Dialog employees, mostly engineers, will join Apple, which will pay $300 million in cash for the transaction and prepay another $300 million for Dialog ... » read more

Week in Review: IoT, Security, Auto


Internet of Things Amazon Web Services announced that Iridium Communications has joined the AWS Partner Network. AWS and Iridium have collaborated on development of Iridium CloudConnect, a service that enables worldwide coverage for Internet of Things applications through Iridium’s satellite network. AWS IoT is being paired with Iridium IoT services as a result. IHS Markit forecasts there wi... » read more

Manufacturing Bits: Jan. 9


Two-photon lithography Lawrence Livermore National Laboratory (LLNL) has extended the capabilities of a high-resolution 3D printing technique called two-photon lithography (TPL). TPL enables the development of 3D-printed objects. LLNL’s technology could enable 3D-printed embedded structures inside the body, such as stents, joint replacements or bone scaffolds. It could also one day be ... » read more

The Week in Review: IoT


Products/Services NXP Semiconductors is partnering with Alibaba Cloud, the cloud computing business unit of Alibaba Group, to develop secure smart devices for edge computing. The companies will also work together on Internet of Things offerings. AliOS, the Alibaba IoT operating system, has been integrated with NXP’s application processors, microcontrollers, and Layerscape multicore processor... » read more

Manufacturing Bits: June 13


FeFET biz heats up The ferroelectric FET (FeFET) market is heating up. One company, Ferroelectric Memory Co. (FMC), has been developing FeFETs, a new memory type for use in standalone and embedded applications. Now, Imec is also developing FeFETs in both planar and vertical varieties. [caption id="attachment_147967" align="alignleft" width="239"] Imec's FeFET (Source: Imec)[/caption] ... » read more

← Older posts Newer posts →