Week In Review: Manufacturing, Test


Chipmakers and OEMs As reported, Intel this week reorganized its operations following delays with its 7nm technology. Intel is behind TSMC and Samsung in technology. As a result, TSMC’s foundry customers, such as AMD, Nvidia and others, are also pulling ahead of Intel. In addition, reports have surfaced that Intel will outsource some of its leading-edge chip production to TSMC. To solve t... » read more

Why Safety-Critical Verification Is So Difficult


The inclusion of AI chips in automotive and increasingly in avionics has put a spotlight on advanced-node designs that can meet all of the ASIL-D requirements for temperature and stress. How should designers approach this task, particularly when these devices need to last longer than the applications? Semiconductor Engineering sat down to discuss these issues with Kurt Shuler, vice president of... » read more

Week In Review: Manufacturing, Test


Market research After years of falling demand, the PC market is back. The second quarter of 2020 ended well for the traditional PC market, including desktops, notebooks, and workstations. Global PC shipments jumped 11.2% year-over-year reaching a total of 72.3 million units, according to IDC. As restrictions around the world tightened in the first few weeks of the quarter, demand for notebo... » read more

Meeting The Power Management Challenges Of The Smart Grid


This white paper reviews the challenges of the modern power distribution grid. Utilizing better power management techniques can improve the design of energy distribution automation systems, resulting in higher energy availability, serviceability, predictive maintenance, as well as fault detection, isolation, and mitigation. Learn new ways of power management to improve the design of automation ... » read more

Week In Review: Manufacturing, Test


Chipmakers A fire broke out this week at a joint NAND flash fab between Western Digital (WD) and Kioxia. Kioxia is the former Toshiba NAND flash unit that was recently spun out by the Japanese company. “On Monday, January 6, (morning, January 7 local time) a small fire occurred at one of our joint venture facilities in Yokkaichi, Japan. Local firefighters quickly extinguished the fire, and w... » read more

MIS Packaging Takes Off


Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on MIS substrate technology, which is ramping up in the analog, power IC and even the cryptocurrency markets. MIS starts with a specialized substrate material for select IC packages. The MIS sub... » read more

The Week In Review: Manufacturing


Chipmakers Lawrence Livermore National Laboratory (LLNL) has purchased a brain-inspired supercomputing platform for deep learning developed by IBM Research. LLNL will receive a 16-chip TrueNorth system from IBM. A single TrueNorth processor from IBM consists of 5.4 billion transistors wired together to create an array of 1 million digital neurons. The chip is fabricated based on a 28nm LPP pro... » read more

The Week In Review: Manufacturing


Is Moore’s Law alive or dead? That’s still a topic for debate. In any case, chipmakers continue to move to advanced nodes, but the transitions are taking longer. Even mighty Intel is struggling, based on what the company said about its 14nm finFET process during an investors meeting this week. In fact, Intel continues to struggle with its yields. “14nm yield is maturing; 14nm is still not... » read more

The Week In Review: Manufacturing


Lam Research’s proposed move to acquire KLA-Tencor is still generating a buzz in the industry. One executive from Lam has explained the reason for the deal. Meanwhile, analysts are also weighing in. “We believe the deal itself is a positive one for Lam as it supplements its leading etch position with the market share leader in process control with significant accretion and earnings leverage... » read more

The Week In Review: Manufacturing


Looking to propel the next wave of OLED displays, Applied Materials has rolled out two new systems. The tools enable the volume production of OLED displays for both mobile products and TVs. In addition, Applied Materials has shipped an Applied TopMet roll-to-roll metal deposition system to Jindal Poly Films, a leader in PET and BOPP films for flexible packaging and labeling applications. In... » read more

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