Chip Industry Week In Review


Acquisitions and business pivots Teradyne acquired Israel-based TestInsight, a semiconductor test provider with pattern conversion, validation, and virtual test capabilities. Credo plans to acquire DustPhotonics, a developer of silicon photonics PICs for optical transceivers. Molex plans to acquire Teramount, a provider of detachable, passive-alignment fiber-to-chip connectivity solu... » read more

Chip Industry Week In Review


Deals IBM and Arm are collaborating on a new dual‑architecture hardware aimed at enterprise AI and data-intensive workloads, using virtualization to boost reliability, security, scalability, and software compatibility. The goal, according to an IBM spokesperson, is to deliver side-by-side deployments of S390x-Linux and Arm-Linux virtual machines in a single kernel-based hypervisor. Nv... » read more

Chip Industry Week In Review


TSMC is expected to reduce its Fab 14 mature-node capacity by 15% to 20% to free up resources for its advanced packaging technologies, reports Counterpoint. The foundry will likely rely on its VIS affiliate site in Singapore (operational in late 2026) and other overseas fabs to ensure continued supply for older nodes. Memory The U.S. threatened 100% tariffs on South Korean memory compan... » read more

Chip Industry Week in Review


Geopolitics Taiwan and the U.S. signed a trade agreement this week, with TSMC and other Taiwanese companies collectively pledging to directly invest at least $250B in investments in advanced semiconductor, energy and AI production and capacity in the U.S.  The agreement also included Taiwan providing another $250B in credit guarantees for additional IC supply chain expansions in the U.S., cap... » read more

Chip Industry Week in Review


SIA's latest monthly global semiconductor sales report reflects a ~30% YOY increase, hitting a record $75.3B in November 2025. Asia Pacific had a notable 66% increase. Cadence launched its Chiplet Spec-to-Packaged Parts ecosystem to accelerate time to market for chiplet development for physical AI, data centers, and HPC applications. Initial IP partners joining Cadence include Arm, Arteris, ... » read more

Chip Industry Week in Review


The Open Compute Project (OCP) Summit kicked off this week in San Jose, dominated by open standards, massive scaling of AI infrastructure, chiplet architectures, and energy-efficiency. Among the highlights: An initiative to standardize data center infrastructure and advance Ethernet for AI. New contributions to OCP's Open Chiplet Economy ecosystem, including Arm's new Foundation Chiplet... » read more

Chip Industry Week in Review


Samsung and SK hynix joined OpenAI's Stargate initiative to ensure there will be enough memory chips to meet the needs of AI data centers. The goal is to produce up to 900,000 DRAM wafer starts per month. OpenAI also inked agreements to explore the development of next-gen data centers in Korea. Axcelis Technologies (ion implantation systems) will merge with Veeco Instruments (compound semic... » read more

Chip Industry Week in Review


Microsoft, OpenAI, and NVIDIA warned about power swings and physical damage to power grids increasing from AI training workloads and jointly proposed a multi-pronged approach to stabilize power in AI training data centers. Meanwhile, Anthropic issued a warning about the weaponization of agentic AI in a new 25-page Threat Intelligence report. Key concerns involve the evolution in AI-assisted ... » read more

Chip Industry Week In Review


The EU’s tariffs on semiconductors will not exceed 15%, according to Trump’s latest trade deal. In addition, the EU committed to purchasing at least $40 billion worth of U.S. AI chips as well as other investments. [FAQ is here.] Lifelines for Intel: Intel inked a deal to sell the U.S. government a 10% non-voting equity stake in its business, worth $8.9 billion. The stake will be fun... » read more

Chip Industry Week in Review


Intel reported flat year-over year revenue for Q2, exceeding Wall Street's pessimistic expectations. In a message to employees, CEO Lip-Bu Tan said the company will: Cut about 15% of its staff, ending the year with about 75,000 employees, down from a high of nearly 132,000 in 2022; Scrap projects in Poland and Germany, consolidate other sites in central America and Southeast Asia, and s... » read more

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