Chip Industry Week In Review


By Jesse Allen, Susan Rambo, and Liz Allan The U.S. government will invest about $3 billion for the National Advanced Packaging Manufacturing Program (NAPMP), including an advanced packaging piloting facility to help U.S. manufacturers adopt new technology and workforce training programs. It also will provide funding for projects concentrating on materials and substrates; equipment, tools, ... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan Bosch, Infineon, and NXP were cleared in Germany to each acquire 10% of the European Semiconductor Manufacturing Co. (ESMC), established by TSMC, solidifying the supply chain against future shortages, particularly for automotive chips. “ESMC intends to build and operate another large semiconductor factory in Dresden, in which the three Europ... » read more

Week In Review: Auto, Security, Pervasive Computing


The AI chip market is booming. Gartner expects revenue for the year will hit $53.4 billion, up 20.9% from 2022. The firm predicts that number will grow to $119 billion by 2027.  In the consumer electronics market, the value of AI-enabled application processors will amount to $1.2 billion in 2023, up from $558 million in 2022. Germany will spend nearly €1 billion (~US$1.7B) over the next t... » read more

Startup Funding: May 2023


Photonic interconnects were an area of activity in May, with two companies raising funds for what could be much faster chip-to-chip and chiplet-to-chiplet links. Microstructured optics and metasurfaces also drew investment, with four companies creating products for a range of applications from flexible LEDs to multi-wavelength spectral imaging. The large language models that power many gener... » read more

Week In Review: Design, Low Power


Synopsys rolled out an AI-driven design suite called Synopsys.ai at the Synopsys User Group conference this week, which it says reduces time to better results at multiple points in the design flow. The company noted the new technology uses reinforcement learning, which compensates for relatively small data sets by allowing engineers to interact with that data more easily at any point, and to ch... » read more

Squeezing The Margins


Back in 2016, we looked at the MediaTek Helio X20, the first Tri-Gear mobile SoC. Tri-Gear is a step beyond ARM’s big.LITTLE concept of using two different cores that have unique power and performance characteristics, by adding a third core. The main advantage to this approach is having more core choices to best run workloads at better energy efficiency and performance operating points. At... » read more

Week In Review: Semiconductor Manufacturing & Test


The Biden Administration’s export bans for semiconductor manufacturing equipment are delaying expansion plans for Chinese chipmakers, Nikkei Asia reports. Yangtze Memory Technologies (YMTC) has halted work on its second memory plant near Wuhan, and ChangXin Memory Technologies (CMTX) says its second production facility, slated to open in 2023, will be delayed until 2024 or 2025. In an effo... » read more

As Chiplets Go Mainstream, Chip Industry Players Collaborate to Overcome New Development Challenges


The semiconductor industry is building a comprehensive chiplet ecosystem to seize on the advantages of the devices over traditional monolithic system-on-chips (SoCs) such as improved performance, lower power consumption, and greater design flexibility. With heterogeneous integration (HI) presenting significant challenges, collaboration to fulfill the potential of chiplets has become even more i... » read more

Week In Review: Design, Low Power


Tools and IP Renesas released a family of configurable clock generators with an internal crystal oscillator for PCIe and networking applications in high-end computing, wired infrastructure and data center equipment. “Timing needs can vary greatly between different applications and equipment, and often change during a product design cycle,” said Zaher Baidas, Vice President of the Timing Pr... » read more

Challenges And Solutions In Chip Design


Ansys is hosting IDEAS Digital Forum 2022, a no-cost virtual event that brings together industry executives and technical design experts to discuss the latest in EDA for Semiconductors, Electronics, and Photonics. The December 6th on-line event starts with Keynote addresses from Raja Koduri from Intel, Pankaj Kukkal from Qualcomm, and insights into the metaverse from DP Prakash with start-up... » read more

← Older posts Newer posts →