tag: MediaTek

Week In Review: Manufacturing, Test
By Mark LaPedus - 23 Aug, 2019 - Comments: 0

AI chip boom or bust? The semiconductor industry is the most bullish about adopting artificial intelligence (AI), according to a new report from Accenture. Some 77% of semiconductor executives surveyed said they have adopted AI within their businesses or are piloting the technology. In addition, 63% of semiconductor executives expect that AI will have the greatest impact on their business over... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 19 Jul, 2019 - Comments: 0

Products/Services Arm rolled out its Flexible Access program, which offers system-on-a-chip design teams the capability to try out the company’s semiconductor intellectual property, along with IP from Arm partners, before they commit to licensing IP and to pay only for what they use in production. The new engagement model is expected to prove useful for Internet of Things design projects and... » read more

Challenges Grow For 5G Packages And Modules
By Mark LaPedus - 18 Jul, 2019 - Comments: 0

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC packages and RF modules for 5G phones are more complex and expensive than today's devices, and that gap will grow significantly in the second phase of 5G. In addition, 5G devices will require an as... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 24 May, 2019 - Comments: 0

Internet of Things The Wing unit of Alphabet this summer will begin making drone deliveries in the Vuosarri district of Helsinki, Finland. The unmanned aerial vehicles will bear food and other items from Herkku Food, a gourmet market, and the Café Monami restaurant. The drones will bear deliveries of up to 3.3 pounds over distances of up to 6.2 miles. Comcast is reportedly developing an in... » read more

5G Heats Up Base Stations
By Kevin Fogarty - 07 May, 2019 - Comments: 4

Before 5G can be deployed commercially on a large scale, engineers have to solve some stubborn problems—including how to make a hot technology a whole lot cooler. 5G-capable modem chipsets are already on the market from Qualcomm, Samsung, Huawei, MediaTek, Intel and Apple, with some 5G service (LTE-Advanced/LTE-Advanced Pro) available in the U.S. But still mostly missing from the 5G equati... » read more

What’s the Right Path For Scaling?
By Mark LaPedus - 02 Jan, 2019 - Comments: 1

The growing challenges of traditional chip scaling at advanced nodes are prompting the industry to take a harder look at different options for future devices. Scaling is still on the list, with the industry laying plans for 5nm and beyond. But less conventional approaches are becoming more viable and gaining traction, as well, including advanced packaging and in-memory computing. Some option... » read more

Toward A 5G, AI-Centric World
By Sundeep Bajikar - 19 Apr, 2018 - Comments: 0

The market environment over the coming years will continue to experience an explosion of data generation from a variety of new sources such as smart cars, smart factories, smart hospitals and smart network infrastructure. Data explosion combined with artificial intelligence (AI) will create a renaissance of computing and storage hardware. Mobile World Congress 2018 (MWC) reinforced this market ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Nov, 2017 - Comments: 0

Market research For some time, DRAM shortages have plagued the market. Today, the situation remains the same. DRAMs are seeing strong demand. But yet, vendors are not adding any capacity. “Strained DRAM supply was even more evident during the third quarter as limited production capacity and limited technological progress for the memory industry encountered robust demand from data centers in ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Nov, 2017 - Comments: 0

Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

The Week In Review: Design
By Jesse Allen - 01 Sep, 2017 - Comments: 0

M&A Silvaco finalized its acquisition of SoC Solutions. The Georgia-based company was founded in 2000. Its team and portfolio of pre-configured IP subsystems and IoT/M2M IP will join Silvaco's IP group. Terms were not disclosed. Siemens PLM will acquire TASS International, a provider of simulation software, engineering and test services aimed primarily at the automotive industry. Based ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy