WiFi Evolves For The IoT

By Bryon Moyer - 06 Aug, 2020 - Comments: 0

WiFi is everywhere, and it’s the most prevalent of the communication protocols that use unlicensed spectrum. But as a common protocol for the Internet of Things (IoT), it faces challenges both because of congestion and the amount of energy it consumes. Two new approaches aim to address those concerns. One is to use multiple channels at once. The second involves the new 802.11ah HaLow stand... » read more

The Week In Review: Design

By Jesse Allen - 24 Feb, 2017 - Comments: 0

M&A ARM made two acquisitions to add the new NarrowBand-IoT (NB-IoT) low power wide area connectivity standard to its designs: Mistbase, founded in 2015 in Sweden, provides a complete NB-IoT physical layer implementation solution, while London-based NextG-Com, founded in 2008, offers a complete layer two and three software stack for NB-IoT. Tools Synopsys released the latest versio... » read more

Preparations for DAC

By Brian Bailey - 27 May, 2016 - Comments: 1

The 53rd DAC is just days away now and the program is pretty well established at this point. It is returning to Austin after a couple of years in San Francisco. In 2013 it was held in this location for the first time and there was a herculean effort to bring the local design community to the event. They did amazing well and while attendance fell slightly compared to the previous year in San Die... » read more

Are Models Holding Back New Methodologies?

By Brian Bailey - 11 Nov, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the state of the industry for [getkc id="101" kc_name="modeling"] at abstractions above [getkc id="49" kc_name="RTL"], a factor which has delayed adoption of [getkc id="104" kn_name="virtual prototypes"] and the proliferation of system-level design and hardware/software codesign. Taking part in the discussion were Frank Schirrmeister, group director... » read more

Are Models Holding Back New Methodologies?

By Brian Bailey - 30 Oct, 2014 - Comments: 1

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Methods2Business

WiFi Evolves For The IoT

The Week In Review: Design

Preparations for DAC

Are Models Holding Back New Methodologies?

Are Models Holding Back New Methodologies?