tag: metrology

Advanced Packaging Drives Test And Metrology Innovations
By Gregory Haley - 12 Nov, 2024 - Comments: 0

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is accelerating, making it harder for the entire ecosystem to keep up with those changes. In the past, major developments were roughly on an 18-month to 2-year cadence. Today, this is happening every few mon... » read more

Metrology Advances Step Up To Sub-2nm Device Node Needs
By Laura Peters - 15 Oct, 2024 - Comments: 0

Metrology and inspection are dealing with a slew of issues tied to 3D measurements, buried defects, and higher sensitivity as device features continue to shrink to 2nm and below. This is made even more challenging due to increasing pressure to ramp new processes more quickly. Metrology tool suppliers must exceed current needs by a process node or two to ensure solutions are ready to meet tig... » read more

Non-Destructive Measurement of Bottom Width in Deep Trench Isolation Structures using IRCD Metrology
By Onto Innovation - 10 Sep, 2024 - Comments: 0

As scaling in semiconductor devices continues, the aspect ratios of deep trench isolation (DTI) structures have increased. DTI structures are used in power devices, power management ICs and image sensors as a method to isolate active devices by reducing crosstalk, parasitic capacitance, latch-up and allowing for an increase breakdown voltage of active devices. Measurement of these structures in... » read more

ECTC 2024 Session Readout: Advancement of Metrology
By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A Electronic Components and Technology Conference (ECTC) session report titled "2024 ECTC Special Session Report: Advancing Metrology for Next-Generation Microelectronics" was published by NIST, Binghamton University, and TechSearch International. Abstract: "Metrology plays a pivotal role in semiconductor research, manufacturing, packaging and assembly. It is critical to the success of this... » read more

Research Bits: Aug. 13
By Jesse Allen - 13 Aug, 2024 - Comments: 0

3D X-ray of chip interiors Researchers from the Paul Scherrer Institute, EPFL Lausanne, ETH Zurich, and the University of Southern California used X-rays to take non-destructive, three-dimensional images of the inside of a microchip at 4 nanometer resolution. To create the images, the researchers relied on a technique called ptychography, in which a computer combines many individual images ... » read more

Metrology And Inspection For The Chiplet Era
By Gregory Haley - 06 Aug, 2024 - Comments: 0

New developments and innovations in metrology and inspection will enable chipmakers to identify and address defects faster and with greater accuracy than ever before, all of which will be required at future process nodes and in densely packed assemblies of chiplets. These advances will affect both front-end and back-end processes, providing increased precision and efficiency, combined with a... » read more

Research Bits: Aug. 5
By Jesse Allen - 05 Aug, 2024 - Comments: 0

Measuring temperature with neutrons Researchers from Osaka University, National Institutes for Quantum Science and Technology, Hokkaido University, Japan Atomic Energy Agency, and Tokamak Energy developed a way to rapidly measure the temperature of electronic components inside a device using neutrons. The technique, called ‘neutron resonance absorption’ (NRA), examines neutrons being ab... » read more

Classification and Localization of Semiconductor Defect Classes in Aggressive Pitches (imec, Screen)
By Technical Paper Link - 01 Aug, 2024 - Comments: 0

A new technical paper titled "An Evaluation of Continual Learning for Advanced Node Semiconductor Defect Inspection" was published by Imec and SCREEN SPE Germany. Abstract "Deep learning-based semiconductor defect inspection has gained traction in recent years, offering a powerful and versatile approach that provides high accuracy, adaptability, and efficiency in detecting and classifying... » read more

Metrology Analysis Tool For Photolithography Process Characterization At Advanced Nodes
By Wolfgang Demmerle - 23 Jul, 2024 - Comments: 0

Continued scaling of integrated circuits to smaller dimensions is still a viable way to increase compute power, achieve higher memory cell density, or reduce power consumption. These days, chip makers are using single-digit nanometer figures or even Angstrom to label their manufacturing technology nodes, which are associated with the size of features patterned during the lithography process. ... » read more

X-ray Inspection Becoming Essential In Advanced Packaging
By Gregory Haley - 09 Jul, 2024 - Comments: 0

X-ray technology is moving into the mainstream of chip manufacturing as complex assemblies and advanced packaging make it increasingly difficult to ensure these devices will work as expected throughout their lifecycles. A single defect in a chiplet or interconnect can transform a complex advanced package into expensive scrap, and the risk only increases as the chip industry shifts from homog... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy