tag: Micron Technology

Manufacturing Bits: Jan. 30
By Mark LaPedus - 30 Jan, 2018 - Comments: 0

SRC’s new R&D centers The Semiconductor Research Corp. has launched a network of research centers within its recently-announced Joint University Microelectronics Program (JUMP). SRC officially launched the 5-year, $200 million program on Jan. 1. With various research centers, the mission of JUMP is to lay the groundwork that extends the viability of Moore’s Law through 2040. The idea is... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Dec, 2016 - Comments: 2

Chipmakers At this week’s IEEE International Electron Devices Meeting (IEDM) in San Francisco, TSMC as well as the team of GlobalFoundries, IBM and Samsung separately presented papers on 7nm finFET technology. Qualcomm has begun sampling the world’s first 10nm server processor. As the first in the Qualcomm Centriq product family, the ARM-based processor has up to 48-cores and is built ... » read more

The Week in Review: IoT
By Jeff Dorsch - 08 Jul, 2016 - Comments: 0

Networks The Netherlands and South Korea are both laying claim to installing the first nationwide Internet of Things networks in the world. In the Netherlands, KPN has connected the country with a low-power, wide-area network optimized for IoT. SK Telecom is serving Korea with coast-to-coast IoT coverage, and the Korean carrier plans to spend up to $86.8 million through the end of 2017 on upg... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 26 Feb, 2016 - Comments: 0

What was the mood at this week’s SPIE Litho? “EUV sentiment is improving among chipmakers as ASML makes progress toward HVM metrics; however, there is still much hedging around timing and readiness. We view EUV adoption as likely to be slow and gradual through 2020,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. “In order for ASML to hit the higher levels of ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 24 Dec, 2015 - Comments: 0

South Korea’s SK Hynix led the initial charge in the development of High Bandwidth Memory (HBM), a 3D DRAM technology based on a memory stack and through-silicon vias (TSVs). SK Hynix has been shipping HBM parts in the market. Now, SK Hynix and Samsung are readying the next version of the technology, dubbed High Bandwidth Memory 2 or HMB2, according to a report from The Electronic Times of So... » read more

Tsinghua Makes $23B Bid For Micron
By Ann Mutschler - 14 Jul, 2015 - Comments: 1

In what would likely be the largest takeover of a U.S. company by a Chinese firm, China's state-owned Tsinghua Unigroup has put in a bid to buy memory giant Micron Technology for $21 a share or $23 billion, according to the Wall Street Journal. The deal is expected to be receive high scrutiny. Tsinghua Unigroup is the largest state-owned chip design company in China, according to Henry Guo, ... » read more

Flash Dance For Inspection And Metrology
By Mark LaPedus - 16 Apr, 2015 - Comments: 0

Chipmakers are moving from planar technology to an assortment of 3D-like architectures, such as 3D NAND and finFETs For these devices, chipmakers face a multitude of challenges in the fab. But one surprising and oft-forgotten technology is emerging as perhaps the biggest challenge in both logic and memory—process control. Process control includes metrology and wafer inspection. Metrolo... » read more

Has 3D NAND Fallen Flat?
By Mark LaPedus - 17 Jul, 2014 - Comments: 0

Today’s planar NAND technology will hit the wall at 10nm, prompting the need for the next big thing in flash memory—3D NAND. In fact, 3D NAND may extend NAND flash memory for the next several years and enable new applications. And it will also drive a new wave of fabs and tool orders. But the transition won’t be as smooth as previous rollouts. 3D NAND is harder to manufacture than pr... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 06 Dec, 2013 - Comments: 0

A new study reveals that a majority of Americans are making some costly miscalculations regarding the performance of their existing PCs. The survey reveals that Americans lack financial savvy when faced with slow computers. Germany’s Merck KGaA, a pharmaceutical, chemical and life science company, announced an agreement with AZ Electronic Materials, under which Merck KGaA would acquire AZ.... » read more

The Week In Review: Aug. 19
By Mark LaPedus - 19 Aug, 2013 - Comments: 0

By Mark LaPedus Applied Materials named Gary Dickerson, who has been serving as president of the company, as CEO. Mike Splinter, who held the reins since 2003, was elevated to executive chairman of the board. Dickerson served as the CEO of Varian, which Applied acquired in 2011, as well as the president and COO of KLA-Tencor. Applied Materials also announced its Q3 results. The company rep... » read more

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