tag: Micron

Transferring Skills Getting Harder
By Ed Sperling - 19 Jan, 2017 - Comments: 0

Rising complexity in developing chips at advanced nodes, and an almost perpetual barrage of new engineering challenges at each new node, are making it more difficult for everyone involved to maintain consistent skill levels across a growing number of interrelated technologies. The result is that engineers are being forced to specialize, but when they work with other engineers with different ... » read more

China Unveils Memory Plans
By Mark LaPedus - 19 Jan, 2017 - Comments: 2

Backed by billions of dollars in government funding, China in 2014 launched a major initiative to advance its domestic semiconductor, IC-packaging and other electronic sectors. So far, though, the results are mixed. China is making progress in IC-packaging, but the nation’s efforts to advance its domestic logic and memory sectors are still a work in progress. In fact, China has yet to achi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Dec, 2016 - Comments: 0

Chipmakers Samsung is mulling over a plan to reorganize its System LSI division, according to a report from BusinessKorea. As part of the move, Samsung is mulling over the idea to spin off its foundry unit, according to the report. A spokeswoman for Samsung’s foundry unit said: “We don't have any comments on this story.” GlobalFoundries has added eight new partners to its FDXcelera... » read more

5 Takeaways from IEDM
By Mark LaPedus - 15 Dec, 2016 - Comments: 1

As usual, the recent IEEE International Electron Devices Meeting (IEDM) was a busy week. The event, which took place in San Francisco, featured a plethora of subjects, such as next-generation transistors and memories. The event also included tracks on non-traditional approaches like quantum and neuromorphic computing. And then, there were sessions on power semis and others. In no partic... » read more

Chip Advances Play Big Role In Cloud
By Gale Morrison - 12 Dec, 2016 - Comments: 0

Semiconductor engineering teams have been collaborating with key players in the data center ecosystem in recent years, resulting in unforeseen and substantial changes in how data centers are architected and built. That includes everything from which boxes, boards, cards and cables go where, to how much it costs to run them. The result is that bedrock communication technology and standards li... » read more

New Wave Of Consolidation
By Ed Sperling - 22 Nov, 2016 - Comments: 0

Consolidation is picking up again across the semiconductor industry, against a backdrop of looming interest rate hikes, geopolitical uncertainty, and the erosion of longstanding demarcations between markets. In the past couple of weeks, Siemens signed a deal to buy [getentity id="22017" e_name="Mentor Graphics"] for $4 billion, and [getentity id="22865" e_name="Samsung"] purchased Harman, a ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 Sep, 2016 - Comments: 0

Chipmakers In 2016, growth in the pure-play foundry business will be driven by leading-edge processes, according to IC Insights. In fact, the increase in pure-play foundry sales this year is forecast to be almost entirely due to processes at » read more

Packaging Wars Begin
By Mark LaPedus - 26 Sep, 2016 - Comments: 1

The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] technologies, high-density fan-out packages and others. At one time, the outsourced semiconductor assembly and test ([getkc id="83" comment="OSAT"]) vendors dominated and handled the chip-packaging requirement... » read more

Sorting Out Next-Gen Memory
By Mark LaPedus - 22 Sep, 2016 - Comments: 8

In the data center and related environments, high-end systems are struggling to keep pace with the growing demands in data processing. There are several bottlenecks in these systems, but one segment that continues to receive an inordinate amount of attention, if not part of the blame, is the memory and storage hierarchy. [getkc id="92" kc_name="SRAM"], the first tier of this hierarchy, is... » read more

Joint R&D Has Its Ups And Downs
By Jeff Dorsch - 07 Sep, 2016 - Comments: 0

As corporate spending on research and development dwindles, enterprises are reaching out to colleges and universities to supplement their R&D. And they often are finding eager partners in those endeavors, as professors and their graduate students look for help, financial and technical, in addressing long-term research projects. “Pure research is just a luxury no one can afford anymore,... » read more

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