tag: Micron

Packaging Wars Begin
By Mark LaPedus - 26 Sep, 2016 - Comments: 1

The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] technologies, high-density fan-out packages and others. At one time, the outsourced semiconductor assembly and test ([getkc id="83" comment="OSAT"]) vendors dominated and handled the chip-packaging requirement... » read more

Sorting Out Next-Gen Memory
By Mark LaPedus - 22 Sep, 2016 - Comments: 8

In the data center and related environments, high-end systems are struggling to keep pace with the growing demands in data processing. There are several bottlenecks in these systems, but one segment that continues to receive an inordinate amount of attention, if not part of the blame, is the memory and storage hierarchy. [getkc id="92" kc_name="SRAM"], the first tier of this hierarchy, is... » read more

Joint R&D Has Its Ups And Downs
By Jeff Dorsch - 07 Sep, 2016 - Comments: 0

As corporate spending on research and development dwindles, enterprises are reaching out to colleges and universities to supplement their R&D. And they often are finding eager partners in those endeavors, as professors and their graduate students look for help, financial and technical, in addressing long-term research projects. “Pure research is just a luxury no one can afford anymore,... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Aug, 2016 - Comments: 0

Chipmakers At this week’s Flash Memory Summit, Samsung rolled out several new products, including its next-generation 3D NAND device and a solid-state drive (SSD) with capacities up to 32 terabytes. At the same time, Samsung introduced a new and high-performance SSD solution, dubbed the Z-SSD. Samsung’s Z-SSD shares the fundamental structure of V-NAND and has a unique circuit design and... » read more

Time For A DDR Background Check
By Pat Sheridan - 28 Jul, 2016 - Comments: 0

In this month’s blog we continue our discussion of power management, specifically looking at how architects can improve the energy efficiency of their SoC as it uses system memory. In March we teamed up with Micron, a global supplier of high performance, low power memory technologies, to present a tutorial at SNUG Silicon Valley (see proceedings) explaining the practical steps system desig... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Jul, 2016 - Comments: 2

Market research Worldwide semiconductor capital spending is projected to decline 0.7% in 2016, to $64.3 billion, according to Gartner. This is up from the estimated 2% decline in Gartner's previous quarterly forecast. "Economic instability, inventory excess, weak demand for PC’s, tablets, and mobile products in the past three years has caused slow growth for the semiconductor industry. This ... » read more

To 7nm And Beyond
By Ed Sperling - 21 Jul, 2016 - Comments: 4

Gary Patton, chief technology officer at [getentity id="22819" comment="GlobalFoundries"], and Thomas Caulfield, senior vice president and general manager of Fab 8, sat down with Semiconductor Engineering to discuss future directions in technology, including the next rev of FD-SOI, the future of Moore’s Law, and how some very public challenges will likely unfold. SE: What do you see as the... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Jul, 2016 - Comments: 2

Fab materials/tools The Reference Project, a pan-European research program created to develop radio-frequency silicon-on-insulator (RF-SOI) technology, was recently launched at the Bernin, France-based facilities of Soitec. Soitec is the project leader in the group, which has an eligible budget of 33 million euros. The project will focus on developing technologies for 4G+ communications usi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 01 Jul, 2016 - Comments: 0

Fab tools Applied Materials has officially rolled out the Producer Selectra system, a selective etch tool. The system falls under the loosely defined category called atomic layer etch (ALE). Applied’s technology addresses a number of challenges. Today’s advanced chips have complex structures. They may also have deep and narrow trenches. One of the challenges is the inability of wet ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Jun, 2016 - Comments: 0

MEMS manufacturing A*STAR’s Institute of Microelectronics (IME) in Singapore has launched its third consortium to develop MEMS technologies. This would allow MEMS sensor devices to achieve better performance, higher power efficiency and a smaller form factor. The MEMS Consortium III consists of the following companies: Applied Materials, Coventor, Delta Electronics, GlobalFoundries, InvenS... » read more

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