Week In Review: Manufacturing, Test


Government policy As reported, the United States is in dire need of more fab capacity as well as packaging plants. The U.S. took a big step in an effort to solve the problem. The U.S. House of Representatives this week introduced the America Competes Act of 2022. The bill includes funding for the Creating Helpful Incentives to Produce Semiconductors for America (CHIPS) Act, which is earmarked... » read more

Week In Review: Auto, Security, Pervasive Computing


Security Arm shipped a prototype CHERI-enabled Morello processor, SoC, and board, the first products coming from the security Morello research program that aims to make more secure hardware that will block certain common attacks. The first board prototypes are going to testing teams at Google, Microsoft, and other major stakeholders and partners across the industry and academia.  The UKRI (UK... » read more

Week In Review: Manufacturing, Test


Chipmakers, OEMs TSMC reported sales of $15.736 billion for the fourth quarter of 2021, up 5.7% sequentially. Net income grew 6.4% quarter-over-quarter. In the fourth quarter, shipments of 5nm accounted for 23% of total wafer revenues, while 7nm accounted for 27%. In the first quarter of 2022, TSMC’s sales are expected to be between $16.6 billion to $17.2 billion. TSMC also expects its 20... » read more

Week In Review: Design, Low Power


Nvidia again made its case for acquiring Arm to the UK's Competition and Markets Authority (CMA). “Arm is a private for-profit business at a crossroads. After acquiring Arm several years ago, SoftBank increased Arm’s headcount, hoping to spur long-term growth in several markets, including data center and personal computer, long dominated by Intel and x86. SoftBank’s investment phase has c... » read more

Week In Review: Manufacturing, Test


Fab tools A fire broke out this week within ASML’s factory in Berlin, Germany. The fire was quickly extinguished and no one was injured during this incident. The factory manufactures components for ASML’s lithography systems, including wafer tables and clamps, reticle chucks and mirror blocks. The fire took place on Jan. 3. On Jan. 7, ASML provided an update. "The manufacturing of DUV c... » read more

Week In Review: Manufacturing, Test


Chipmakers TSMC has introduced another version of its 4nm process technology. The process, called N4X, is tailored for high-performance computing products. Recently, TSMC introduced another 4nm process, called N4P, which is an enhanced version of its 5nm technology. N4X is also an enhanced version of its 5nm technology. N4X, however, offers a performance boost of up to 15% over TSMC’s N5 pro... » read more

Blog Review: Dec. 21


Cadence's Paul McLellan points to Log4J, a logging utility with a new major vulnerability that could affect hundreds of millions of devices, what's being done to address it, and why the underlying problems may be around for decades. Siemens EDA's Ray Salemi continues explaining how to use Python for verification by checking out the Python logging module for pyuvm and how it compares to UVM r... » read more

Week In Review: Manufacturing, Test


Packaging and test Taiwan’s ASE--the world’s largest OSAT--has announced the proposed sale and disposal of equity interests in its subsidiaries, GAPT Holding and ASE (Kun Shan), to Wise Road Capital, a private equity firm based in China. The deal has a value of $1.46 billion. The announcement is related to four ASE assembly and test facilities in China, including Shanghai, Suzhou, Kunsh... » read more

Week In Review: Manufacturing, Test


Chipmakers China’s Tsinghua Unigroup is in trouble. The group is the parent company of China’s YMTC, a 3D NAND supplier, and other chip ventures. It is close to moving into bankruptcy proceedings. Now, a consortium led by Alibaba has emerged as the frontrunner to take over Tsinghua Unigroup, according to a report from Bloomberg. That deal would keep the company afloat, the report said. ... » read more

Outlook: DRAM, NAND, Next-Gen Memory


Jim Handy, director at Objective Analysis, sat down with Semiconductor Engineering to talk about the 3D NAND, DRAM and next-generation memory markets. What follows are excerpts of that discussion. SE: How would you characterize the NAND market thus far in 2021? Handy: All chips are seeing unusual strength in 2021, but NAND flash and DRAM are doing what they usually do by exhibiting more e... » read more

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