Shim Il Kwon, CTO at STATS ChipPAC, sat down with Semiconductor Engineering to discuss the current and future trends of chip packaging. What follows are excerpts of that conversation.
SE: The outsourced semiconductor assembly and test (OSAT) vendors provide third-party IC-packaging and test services. What are the big challenges for OSATs today?
Shim: The OSAT market is very competitive, w...
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