Chip Industry Week In Review

By The SE Staff - 08 Sep, 2023 - Comments: 0

By Liz Allan, Jesse Allen, and Karen Heyman Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in Q2, and slipped 4% compared with Q1, according to SEMI. Similarly, the top 10 semiconductor foundries reported a 1.1% quarterly-over-quarter revenue decline in Q2. A rebound is anticipated in Q3, according to TrendForce. Synopsys extended its AI-driven EDA ... » read more

Using FPGAs For AI

By Brian Bailey - 02 Dec, 2019 - Comments: 3

Artificial intelligence (AI) and machine learning (ML) are progressing at a rate that is outstripping Moore's Law. In fact, they now are evolving faster than silicon can be designed. The industry is looking at all possibilities to provide devices that have the necessary accuracy and performance, as well as a power budget that can be sustained. FPGAs are promising, but they also have some sig... » read more

Week In Review: Design, Low Power

By Jesse Allen - 16 Nov, 2018 - Comments: 0

Tools & Standards Mentor uncorked a PCB design platform for non-specialist PCB engineers focused on multi-dimensional verification. The Xpedition platform can integrate a range of verification tools within a singular authoring environment, providing automatic model creation, concurrent simulation, cross probing from results, and error reviews to identify problems at the schematic or layout... » read more

What Makes A Good AI Accelerator

By Ann Mutschler - 25 Oct, 2018 - Comments: 3

The rapid growth and dynamic nature of AI and machine learning algorithms is sparking a rush to develop accelerators that can be optimized for different types of data. Where one general-purpose processor was considered sufficient in the past, there are now dozens vying for a slice of the market. As with any optimized system, architecting an accelerator — which is now the main processing en... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: MIPSOLOGY

Chip Industry Week In Review

Using FPGAs For AI

Week In Review: Design, Low Power

What Makes A Good AI Accelerator