Advanced mm-Wave And Terahertz Measurements With Cascade Probe Stations

The strong market needs to embed multiple functionalities from different semiconductor processing technologies into a single system continue to drive demands for more advanced 3DIC packaging technologies. Dimensions of copper pillar micro-bumps are consistently reduced in every new technology node to facilitate the 3D stacking of multiple dies so that overall system performance can be improved.... » read more

Parametric Analysis, Design Guidelines for mm-Wave nm CMOS Transmission Lines

This paper focuses on nm CMOS transmission line design as distributed passive elements and their application in mm-wave integrated circuits. A variety of transmission lines such as coplanar waveguides (CPWs), shielded coplanar waveguides (SCPWs), and CPW with ground are analyzed in terms of their geometry and electrical properties. The parametric analysis of the various line types is based on a... » read more