RF GaN Gains Steam

By Mark LaPedus - 25 Jul, 2016 - Comments: 0

The RF [getkc id="217" kc_name="gallium nitride"] (GaN) device market is heating up amid the need for more performance with better power densities in a range of systems, such as infrastructure equipment, missile defense and radar. On one front, for example, RF GaN is beginning to displace a silicon-based technology for the power amplifier sockets in today’s wireless base stations. GaN is m... » read more

Still Waiting For III-V Chips

By Mark LaPedus - 19 Feb, 2015 - Comments: 0

For years, chipmakers have been searching for an alternative material to replace traditional silicon in the channel for advanced CMOS devices at 7nm and beyond. There’s a good reason, too: At 7nm, silicon will likely run out of steam in the channel. Until recently, chipmakers were counting on III-V materials for the channels, at least for NFET. Compared to silicon, III-V materials provide ... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 07 Nov, 2014 - Comments: 0

China’s Jiangsu Changjiang Electronics Technology (JCET) has made a bid to acquire STATS ChipPAC for $780 million, according to reports. This year’s top-20 chip ranking includes two pure-play foundries--TSMC and UMC--and six fabless companies, according to IC Insights. GlobalFoundries is forecast to be replaced in this year’s top 20 ranking by fabless IC supplier Nvidia, according to t... » read more

How To Lower LED Costs

By Mark LaPedus - 17 Jul, 2014 - Comments: 2

The LED market remains hot, particularly in the solid-state lighting segment. In fact, solid-state lighting continues to expand amid a precipitous drop in LED prices. And LEDs are expanding into new fronts, such as automotive and intelligent lighting. The LED boom hasn’t been fun for all parties, however. Amid pressure to reduce their tool costs, LED equipment makers are still in the mids... » read more

LED Firms Mull New Wafer Sizes And Materials

By Ed Sperling - 16 Aug, 2012 - Comments: 0

By Mark LaPedus Seeking to reduce the cost of solid-state lighting and related applications, LED manufacturers are taking a page from the IC industry: They are looking at larger wafer sizes and new materials in the fab. Today, the state-of-the-art LED fab is a 150mm (6-inch) facility, but a large percentage of these plants are still using 50mm (2-inch) substrates. The vast majority of LED s... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: MOCVD

RF GaN Gains Steam

Still Waiting For III-V Chips

The Week In Review: Manufacturing

How To Lower LED Costs

LED Firms Mull New Wafer Sizes And Materials