Can Models Created With AI Be Trusted?

By Brian Bailey - 06 May, 2024 - Comments: 0

EDA models that are created using AI need to pass more stringent quality and cost benefit analysis compared to many AI applications in the broader industry. Money is hanging on the line if AI gets it wrong, and all the associated costs must be factored into the equation. Models are some of the most expensive things a development team can create, and it is important to understand the value th... » read more

System State Challenges Widen

By Brian Bailey - 30 Nov, 2023 - Comments: 0

Knowing the state of a system is essential for many analysis and debug tasks, but it's becoming more difficult in heterogeneous systems that are crammed with an increasing array of features. There is a limit as to how many things engineers can keep track of, and the complexity of today's systems extends far beyond that. Hierarchy and abstraction are used to help focus on the important aspect... » read more

The Limits Of AI-Generated Models

By Brian Bailey - 26 Oct, 2023 - Comments: 2

In several recent stories, the subject of models has come up, and one recurrent theme is that AI may be able to help us generate models of a required abstraction. While this may be true in some cases, it is very dangerous in others. If we generalize, AI should be good for any model where the results are predominantly continuous, but discontinuities create problems. Unless those are found and... » read more

Anatomy Of A System Simulation

By Brian Bailey - 26 Oct, 2023 - Comments: 0

The semiconductor industry has greatly simplified analysis by consolidating around a small number of models and abstractions, but that capability is breaking down both at the implementation level and at the system level. Today, the biggest pressure is coming from the systems industry, where the electronic content is a small fraction of what must be integrated together. Systems companies tend... » read more

The Federation Needs A Taxonomy

By Brian Bailey - 28 Sep, 2023 - Comments: 0

While putting together the story about federated simulation, it brought back memories of an earlier part of my career when I spent a lot of time looking at modeling abstractions and simulation frameworks. In the mid-1990s, the notions of re-using pre-designed blocks of IP started to become popular, but the fledgling industry was in disarray. Every IP block had a different set of deliverables... » read more

Industry Pressure Grows For Simulating Systems Of Systems

By Brian Bailey - 28 Sep, 2023 - Comments: 0

Most complex systems are designed in a top-down manner, but as the amount of electronic content in those systems increases, so does the pressure on the chip industry to provide high-level models and simulation capabilities. Those models either do not exist today, or they exist in isolation. No matter how capable a model or simulator, there never will be one that can do it all. In some cases,... » read more

Improving Chip Efficiency, Reliability, And Adaptability

By Ed Sperling - 08 Dec, 2022 - Comments: 0

Peter Schneider, director of Fraunhofer Institute for Integrated Circuits' Engineering of Adaptive Systems Division, sat down with Semiconductor Engineering to talk about new models and approaches for ensuring the integrity and responsiveness of systems, and how this can be done within a given power budget and at various speeds. What follows are excerpts of that conversation. SE: Where are y... » read more

Simplifying AI Edge Deployment

By Ed Sperling - 10 Oct, 2022 - Comments: 0

Barrie Mullins, vice president of product at Flex Logix, explains how a programmable accelerator chip can simplify semiconductor design at the edge, where chips need to be high performance as well as low power, yet developing everything from scratch is too expensive and time-consuming. Programmability allows these systems to stay current with changes in algorithms, which can affect everything f... » read more

Distilling The Essence Of Four DAC Keynotes

By Brian Bailey - 28 Jul, 2022 - Comments: 0

Chip design and verification are facing a growing number of challenges. How they will be solved — particularly with the addition of machine learning — is a major question for the EDA industry, and it was a common theme among four keynote speakers at this month's Design Automation Conference. DAC has returned as a live event, and this year's keynotes involved the leaders of a systems comp... » read more

Setting Ground Rules For 3D-IC Designs

By Ed Sperling - 12 Jan, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?