What Happened To Nanoimprint Litho?

By Mark LaPedus - 29 Mar, 2018 - Comments: 4

Nanoimprint lithography (NIL) is re-emerging amid an explosion of new applications in the market. Canon, EV Group, Nanonex, Suss and others continue to develop and ship NIL systems for a range of markets. NIL is different than conventional lithography and resembles a stamping process. Initially, a lithographic system forms a pattern on a template based on a pre-defined design. Then, a separa... » read more

Ready For Nanoimprint?

By Michael Watts - 17 Mar, 2016 - Comments: 0

Nanoimprint has been discussed, debated, and hyped since the term was first introduced in 1996. Now, a full 20 years later, it is being taken much more seriously in light of increasing photomask costs and delays in bringing alternatives to market. Nanoimprint lithography is something like a room-temperature UV cure embossing process. The structures are patterned onto a template or mold using... » read more

Molecular Imprints becomes a virtual reality company

By Michael Watts - 14 Jul, 2015 - Comments: 0

Molecular Imprints was the venture funded imprint equipment start up, that was split up last year when the semiconductor applications were acquired by Canon. Sources tell me that the remaining non-semiconductor portion Molecular Imprints has been acquired by Magic Leap, a virtual reality start up that raised $542M last year in a B round led by Google. Magic Leap has developed a proprietary... » read more

The Uncertain Future Of Hard Drives

By Michael Watts - 17 Jul, 2014 - Comments: 0

The future of hard drives has been an iffy subject for nearly a decade. The most recent pressure has come from solid-state drives made from flash memory, which have transformed cell phones and tablets and other portable appliances. But the Internet has driven a staggering demand for data storage and the hard drive business has thrived. The question of what’s next for hard drives first appe... » read more

Billions And Billions Invested

By Mark LaPedus - 17 Apr, 2014 - Comments: 4

Over the years, next-generation [getkc id="80" kc_name="lithography"] (NGL) has suffered various setbacks and delays. But until recently, the industry basically shrugged its shoulders and expressed relatively little anxiety about the NGL delays. After all, optical lithography was doing the job in the fab and NGL would eventually materialize. Today, however, the mood is different. In fact, th... » read more

A Milestone In Imprint Lithography

By Michael Watts - 20 Feb, 2014 - Comments: 0

The announcement on Feb. 13 of the acquisition of the semiconductor arm of Molecular Imprints (MII) by Canon is a seminal event in the story of imprint patterning. Full disclosure requires me to mention that as a founding team member at Molecular Imprints, my founders shares are now worth something — but well short of not needing to write a free blog as a marketing exercise for my consulting ... » read more

Making An Impression with Nanoimprint

By Mark LaPedus - 21 Mar, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss the trends in lithography with Mark Melliar-Smith, president and chief executive of Molecular Imprints Inc. (MII), a supplier of nanoimprint lithography tools. SMD: How do you view the IC industry now? Melliar-Smith: It’s truly incredible work that this industry continues to do. The industry will see its way f... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.