Manufacturing Bits: Jan. 3

By Mark LaPedus - 03 Jan, 2022 - Comments: 1

Gallium oxide chips Looking to commercialize a promising ultra wide-bandgap technology in the market, Novel Crystal Technology (NCT) has developed a Schottky barrier diode based on a material called gallium oxide. NCT devised an ampere-class 1,200-V diode based on gallium oxide. A diode is a device that passes electricity in one direction and blocks it in the opposite direction. Still in R&... » read more

SiC Chip Demand Surges

By Mark LaPedus - 20 Sep, 2018 - Comments: 0

The silicon carbide (SiC) power semiconductor market is experiencing a sudden surge in demand amid growth for electric vehicles and other systems. But the demand also is causing a tight supply of SiC-based devices in the market, prompting some vendors to add fab capacity in the midst of a tricky wafer-size transition. Some SiC device makers are transitioning from 4- to 6-inch wafers in the f... » read more

The Week in Review: IoT

By Jeff Dorsch - 15 Dec, 2017 - Comments: 1

Products/Services NXP Semiconductors is partnering with Alibaba Cloud, the cloud computing business unit of Alibaba Group, to develop secure smart devices for edge computing. The companies will also work together on Internet of Things offerings. AliOS, the Alibaba IoT operating system, has been integrated with NXP’s application processors, microcontrollers, and Layerscape multicore processor... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Mouser Electronics

Manufacturing Bits: Jan. 3

SiC Chip Demand Surges

The Week in Review: IoT

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