Development and Deployment of 2.5D Multi-Foundry Chiplet Solution Scaling Beyond Multi-Reticle Approaches (Intel)


A new technical paper titled "System-Level Validation Across Multiple Platforms to build a Robust 2.5D Multi Foundry Chiplet Solution" was published by researchers at Intel Corporation. Abstract "The proliferation of chiplet-based designs, driven by the escalating computational demands of AI, presents unique validation challenges when integrating heterogenous chiplets. This paper investigat... » read more