Research Bits: Feb. 6


Pillars for chiplet integration Researchers from the Tokyo Institute of Technology proposed a new chiplet integration technology called Pillar-Suspended Bridge (PSB), which they say is a simpler method of chip-to-chip connection compared to silicon interposers and redistribution layers. In the PSB, only a pillar-shaped metal structure called a "MicroPillar" is interposed at the connection b... » read more

The development of integrated circuits based on two-dimensional materials


Abstract Two-dimensional (2D) materials could potentially be used to develop advanced monolithic integrated circuits. However, despite impressive demonstrations of single devices and simple circuits—in some cases with performance superior to those of silicon-based circuits—reports on the fabrication of integrated circuits using 2D materials are limited and the creation of large-scale circu... » read more

Manufacturing Bits: May 18


Mystery of MXenes Aalto University has studied the surface composition and provided some new insights into MXenes, a promising set of materials used for energy storage and related applications. A class of two-dimensional inorganic compounds, MXenes consist of thin atomic layers. The materials are based on transition metal carbides, nitrides or carbonitrides. These materials have extraord... » read more

Power/Performance Bits: Feb. 2


MXene antennas Researchers at Drexel University and Villanova University developed spray-on antennas made of the 2D materials MXene that is flexible and light while maintaining good signal. "This combination of communications performance with extreme thinness, flexibility and durability sets a new standard for antenna technology," said Yury Gogotsi, professor of Materials Science and Engine... » read more