Week In Review: Manufacturing, Test

By Mark LaPedus - 13 Aug, 2021 - Comments: 0

Chipmakers and OEMs Samsung has announced its latest foldable smartphones--the Galaxy Z Fold3 5G and Galaxy Z Flip3 5G. The systems are based on Samsung’s 5nm application processor. One system is the company’s most affordable foldable phone. The Galaxy Z Fold3 is $1,799.99, while the Galaxy Z Flip3 is $999.99. Samsung also announced two smartwatches—the Galaxy Watch4 and Galaxy Watch4... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 23 Apr, 2021 - Comments: 0

Chipmakers and OEMs Several foundry vendors are building new fabs. The memory vendors, such as Samsung and SK Hynix, are also building new capacity. In another example, Taiwan DRAM supplier Nanya Technology plans to construct a new 300mm fab in the Taishan Nanlin Technology Park in New Taipei City. The plant will produce DRAMs with Nanya’s in-house developed 10nm-class process technologies a... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 02 Jun, 2017 - Comments: 0

Market research IC Insights has released its capital spending forecast by company. In total, there are 15 companies that are forecast to have semiconductor capital expenditures of $1.0 billion or more in 2017, up from 11 in 2016, according to IC Insights. Four companies—Intel, Samsung, GlobalFoundries, and SK Hynix—are expected to represent the bulk of the increase in spending, accord... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 18 Jul, 2014 - Comments: 0

IBM’s move to sell its chip business to GlobalFoundries may have stalled or is dead, according to the Albany Times Union and other news outlets. New York Governor Andrew Cuomo announced that the state will partner with over 100 private companies, led by GE, to launch the New York Power Electronics Manufacturing Consortium. GE will be a lead partner in a fab, housed at the CNSE Nano Tech co... » read more

Semiconductor New Equipment Market $32.0 Billion For 2013

By Lara Chamness - 12 Dec, 2013 - Comments: 0

Orders for new equipment slowly improved early on in 2013, with bookings reaching a peak by the second quarter before receding in the third quarter. Over this time, equipment billings, while increasing, were trending below 2012 levels. In October, book-to-bill data from both SEMI and the SEAJ show bookings are increasing once again, and this indicates a stronger fourth quarter for the semico... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Nanya

Week In Review: Manufacturing, Test

Week In Review: Manufacturing, Test

The Week In Review: Manufacturing

The Week In Review: Manufacturing

Semiconductor New Equipment Market $32.0 Billion For 2013