Radiation, Temperature, Power Challenges For Chips In Space

By Liz Allan - 07 May, 2025 - Comments: 0

Mission-critical hardware used in space is not supposed to fail at all, because lives may be lost in addition to resources, availability, performance, and budgets. For space applications, failure can occur due to a range of factors, including the weather on the day of launch, human error, environmental conditions, unexpected or unknown hazards and degradation of parts to chemical factors, aging... » read more

Extra Safety Measures Needed For Aerospace ICs

By Liz Allan - 01 May, 2025 - Comments: 0

Aerospace safety requirements and standards vary depending on whether a spacecraft is manned or unmanned, and how crucial the mission is. The defense contractors designing these spacecraft take various approaches to functional safety based on how critical a component is for the mission to succeed. While losing a few images during an Earth-bound observation may not matter, losing a satellite ... » read more

Chip Industry Week In Review

By The SE Staff - 18 Apr, 2025 - Comments: 0

[Podcast version is here.] TSMC said it will produce 30% of its leading-edge chips in Arizona when all six of its fabs are operational, a total investment of $165 billion, Axios reported. In its latest SEC filing, the foundry said it continues to add capacity in Taiwan, Arizona, Japan, and Germany. The Trump administration launched a Section 232 investigation into semiconductors and relat... » read more

Engineer’s Guide to Simulation of Aeroacoustics

By Cadence - 03 Apr, 2025 - Comments: 0

Aeroacoustics is the study of noise generation due to turbulent fluid motion or the interaction of aerodynamic forces with surfaces. It is a branch of acoustics that focuses on how aerodynamic sound is generated, propagated, and transmitted to the environment. This guide provides an in-depth exploration of the specific challenges and techniques associated with aeroacoustics simulations. Key ... » read more

Stakes Are High For Aerospace, Defense IC Designs

By Liz Allan - 03 Apr, 2025 - Comments: 0

Chips destined for the skies or armed forces need extra everything. They require higher layers of abstraction to simulate all the moving parts in the field, high-reliability testing for harsh environments, in addition to system-level test. They also need radiation-hardening and ceramic materials for space, extra safety layers, and advanced security techniques. As in the automotive sector, th... » read more

Chip Industry Week In Review

By The SE Staff - 10 Jan, 2025 - Comments: 0

Global semiconductor sales hit $57.8 billion in November 2024, an increase of 20.7% compared to the same month last year, according to the Semiconductor Industry Association. In U.S. government news: The U.S. Department of Commerce finalized up to $325 million in CHIPS Act funding for Hemlock Semiconductor, which will support construction of a new semiconductor-grade polysilicon manufac... » read more

Chip Industry Week In Review

By The SE Staff - 13 Sep, 2024 - Comments: 0

Infineon rolled out the world's first 300mm gallium nitride (GaN) wafer, opening the door for high-volume manufacturing of GaN-based power semiconductors. A 300mm wafer contains 2.3 times as many chips per wafer as a 200mm wafer. Fig.1: Infineon's 300mm GaN wafer. Source: Infineon The Semiconductor Industry Association released its 2024 State of the U.S. Semiconductor Industry report th... » read more

Chip Industry Week In Review

By The SE Staff - 09 Aug, 2024 - Comments: 0

Three Fraunhofer Institutes (IIS/EAS, IZM, and ENAS) launched the Chiplet Center of Excellence, a research initiative to support the commercial introduction of chiplet technology. The center initially will focus on automotive electronics, developing workflows and methods for electronics design, demonstrator construction, and the evaluation of reliability. The UCIe Consortium published the Un... » read more

Chip Industry Week In Review

By The SE Staff - 01 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan's Powerchip. The second fab will be a joint investment between CG Power, Japan's Renesas Electronics, and Thailand's Stars Microelectronics. Tata will run t... » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 28 Jul, 2023 - Comments: 0

BMW, General Motors, Honda, Hyundai, Kia, Mercedes-Benz, and Stellantis will create an electric vehicle charging network, installing more than 30,000 high-powered DC charge points accessible to any cars that use Combined Charging System (CCS) or North American Charging Standard (NACS) connectors. Opening summer 2024, the network will leverage Plug & Charge technology and allow easy digital ... » read more

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tag: NASA

Radiation, Temperature, Power Challenges For Chips In Space

Extra Safety Measures Needed For Aerospace ICs

Chip Industry Week In Review

Engineer’s Guide to Simulation of Aeroacoustics

Stakes Are High For Aerospace, Defense IC Designs

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Week In Review: Auto, Security, Pervasive Computing

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Chip Industry Week in Review

Three-Way Race To 3D-ICs

Chip Industry Week in Review