Manufacturing Bits: Aug. 3

By Mark LaPedus - 03 Aug, 2021 - Comments: 0

World’s thinnest magnet Lawrence Berkeley National Laboratory, the University of California at Berkeley and others have developed what researchers say is the world’s thinnest magnet. The one-atom-thin, two-dimensional (2D) magnet could one day pave the way towards new spin electronics or spintronics memory devices and other technologies in the market. Spintronics uses the orientation of... » read more

Manufacturing Bits: Aug. 14

By Mark LaPedus - 14 Aug, 2018 - Comments: 0

Strange metals The National High Magnetic Field Laboratory (National MagLab) has unraveled the behavior in a new class of high-temperature superconductor (HTS) materials called cuprates. Cuprates are sometimes referred as a "strange" or "bad" metal. They don't conduct electricity well despite being a superconducting material. Superconductors are devices that have zero electrical resistance,... » read more

Manufacturing Bits: Oct. 6

By Mark LaPedus - 06 Oct, 2015 - Comments: 0

Magnetic mass spectrometers The National High Magnetic Field Laboratory (National MagLab) has developed a mass spectrometer, based on what the organization claims is the world’s highest field superconducting magnet. The instrument from National MagLab is called a Fourier transform ion cyclotron resonance (FT-ICR) mass spectrometer. The mass spectrometer boasts a 21 tesla magnet, which is ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: National MagLab

Manufacturing Bits: Aug. 3

Manufacturing Bits: Aug. 14

Manufacturing Bits: Oct. 6