Week in Review: IoT, Security, Auto

By Jeff Dorsch - 21 Dec, 2018 - Comments: 0

Internet of Things Unmanned aerial vehicles are delivering vaccines to the very remote village of Cook’s Bay, on the island of Erromango, one of 83 volcanic islands in the South Pacific nation of Vanuatu. The drones can go from island to island faster than boats, which often are not a travel option during rough weather. Vanuatu this week began its vaccine deliveries by drones with support fr... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 17 Aug, 2018 - Comments: 0

Cybersecurity Check Point Software Technologies reports that facsimile machines (yes, people still use them!) can be subject to hacking through vulnerabilities in their communication protocols. The HP Officejet Pro All-in-One fax printers and other fax machines can be compromised with a hacker only knowing a fax number, according to the company. Check Point Research says a design flaw in Andro... » read more

The Road To Autonomy

By Jeff Dorsch - 01 Feb, 2018 - Comments: 0

Visions of autonomous driving were everywhere at CES 2018 in Las Vegas and the North American International Auto Show in Detroit. Still, while there is progress in the technology, it will be years before the average motorist can get a fully autonomous vehicle. Advanced driver-assistance systems are gaining in complexity and scope, representing steps toward automated driving. At CES 2018, ... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 30 Dec, 2016 - Comments: 0

CES mania At the upcoming CES in Las Vegas, Samsung Electronics will unveil the CH711, a new curved monitor based on quantum dot technology. Designed for gamers, the CH711 is available in 27- and 31.5-inch variations. The monitors feature a 1,800R curvature, an ultra-wide 178-degree viewing angle and a 2,560 x 1,440 WQHD resolution. [caption id="attachment_33488" align="alignleft" width="30... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: NAVYA

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

The Road To Autonomy

The Week In Review: Manufacturing