The Week In Review: Design/IoT

By Jesse Allen - 06 May, 2016 - Comments: 0

Standards The IEEE launched the International Roadmap for Devices and Systems (IRDS), effectively setting the industry agenda for future silicon benchmarking and adding metrics that are relevant to specific markets rather than creating the fastest general-purpose processing elements at the smallest process node. For more on the IRDS, check out Ed Sperling's analysis. Accellera's SystemC A... » read more

End Of Mixed Signal Engineering?

By Ed Sperling - 04 May, 2016 - Comments: 1

EDA companies are stepping back after years of trying to force engineers to combine analog and digital disciplines. Rather than emphasizing [getkc id="38" kc_name="mixed signal"] as a single expertise, they are building bridges and translation mechanisms between the two worlds. The moves cap more than a decade of trying to find optimal ways to pack [getkc id="37" kc_name="analog"] and digita... » read more

Way Too Much Data

By Ed Sperling - 28 Apr, 2016 - Comments: 0

Moving to the next process nodes will produce volumes more data, forcing chipmakers to adopt more expensive hardware to process and utilize that data, more end-to-end methodologies, as well as using tools and approaches that in the past were frequently considered optional. Moreover, where that data needs to be dealt with is changing as companies adopt a "shift left" approach to developing so... » read more

Automating Front-End SoC Design With NetSpeed’s On-Chip-Network IP

By NetSpeed Systems - 27 Apr, 2016 - Comments: 0

This white paper from The Linley Group examines the challenges of turning SoC architecture specifications into successful design implementations. It presents the case that SoCs are becoming too large and complex for existing design methodologies and identifies the need for a more automated front-end design process. To read more, click here. » read more

Planes, Cars, And Lagging Standards

By Ed Sperling - 28 Mar, 2016 - Comments: 0

Automotive and aerospace standards are struggling to adapt to pervasive connectivity, increased functionality, and new packaging approaches and architectures, leaving chipmakers and systems vendors unsure about what needs to be included in future designs. Each of these markets has a reputation for being lumbering and unresponsive, in part because they deal with safety-critical issues and i... » read more

Pain Points At 7nm

By Ed Sperling - 24 Mar, 2016 - Comments: 3

Early work has begun on 7nm. Process technology has progressed to the point where IP and tools are being qualified. There is still a long way to go. But as companies begin engaging with foundries on this process node—[getentity id="22586" comment="TSMC"] is talking publicly about it, but [getentity id="22846" e_name="Intel"], [getentity id="22819" comment="GlobalFoundries"] and [getentity ... » read more

Coherency, Cache And Configurability

By Ann Mutschler - 24 Mar, 2016 - Comments: 0

Coherency is gaining traction across a wide spectrum of applications as systems vendors begin leveraging heterogeneous computing to improve performance, minimize power, and simplify software development. Coherency is not a new concept, but making it easier to apply has always been a challenge. This is why it has largely been relegated to CPUs with identical processor cores. But the approach ... » read more

The Making Of A System Architect

By Sundari Mitra - 24 Mar, 2016 - Comments: 0

I mentor young people from the University of Illinois at Urbana-Champaign, where I got my MSEE. When I talk to them, they tell me they’re applying for chip architecture jobs. But when they graduate with their computer science degrees they all get channeled into verification jobs. Why verification jobs rather than architecture jobs? Because they don’t have a feel for the full architecture. T... » read more

The First Fully Configurable Cache-Coherent Interconnect Solution For SoCs

By NetSpeed Systems - 23 Mar, 2016 - Comments: 0

The last few decades have seen a massive growth in the number of CPU cores, computing clusters and other IP blocks in a SoC. This massive growth along with the need for complex chip integration has driven the need for sophisticated interconnects. SoC architects have employed a variety of methods from buses to crossbars to handcrafted NoCs with Lego-like blocks with varying degrees of success. T... » read more

How Many Cores? (Part 2)

By Ed Sperling - 21 Mar, 2016 - Comments: 1

New chip architectures and new packaging options—including fan-outs and 2.5D—are changing basic design considerations for how many cores are needed, what they are used for, and how to solve some increasingly troublesome bottlenecks. As reported in part one, just adding more cores doesn't necessarily improve performance, and adding the wrong size or kinds of cores wastes power. That has s... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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