Preparing For The IoT Data Tsunami

By Ann Mutschler - 29 Feb, 2016 - Comments: 0

Engineering teams are facing a flood of data that will be generated by the [getkc id="76" comment="Internet of Things"], both from the chip design side and from the infrastructure required to handle that data. There are several factors that make this problem particularly difficult to deal with. First, there is no single data type, which means data has to be translated somehow into a usable f... » read more

Advancing SoC Technology

By John Bainbridge - 25 Feb, 2016 - Comments: 0

As chip designers, we take logic synthesis for granted. It’s hard to imagine the days when engineers had to design digital logic by hand. But then, it’s no less mind-boggling to believe that NASA engineers used slide rules to calculate and plan the Apollo 11 mission that first landed on the moon. Were engineers just a whole lot smarter in the old days? Maybe. But it’s also true that c... » read more

An Architecture Synthesis Platform For Rapidly Evolving SoC Designs

By NetSpeed Systems - 24 Feb, 2016 - Comments: 0

Modern System-on-Chip (SoC) architects are faced with a number of serious challenges. First, the number of Semiconductor Intellectual Property (IP) blocks in SoC designs is growing continuously and increasing design complexity. With IP design reuse becoming more common, the mixing and matching of IP components is further compounding design complexity. Second, sophisticated SoC applications are ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: NetSpeed Systems

Preparing For The IoT Data Tsunami

Advancing SoC Technology

An Architecture Synthesis Platform For Rapidly Evolving SoC Designs