tag: New York University

Chip Industry Week In Review
By The SE Staff - 27 Sep, 2024 - Comments: 0

Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. Key drivers are the regionalization of semiconductor fabs and the increasing demand for AI chips in data centers and edge devices, with China, South Korea, and Taiwan leading the way. The Biden-Harris Administration launched the National Semiconductor Technology Center’... » read more

Security Technical Paper Roundup: Aug. 27
By Liz Allan - 27 Aug, 2024 - Comments: 0

A number of hardware security-related technical papers were presented at the August 2024 USENIX Security Symposium. The organization provides open access research, and the presentation slides and papers are free to the public. Topics include side-channel attacks and defenses, embedded security, fuzzing, fault injection, logic locking, Rowhammer, and more. Here are some highlights with associate... » read more

Chip Industry Week In Review
By The SE Staff - 31 May, 2024 - Comments: 0

JEDEC and the Open Compute Project rolled out a new set of guidelines for standardizing chiplet characterization details, such as thermal properties, physical and mechanical requirements, and behavior specs. Those details have been a sticking point for commercial chiplets, because without them it's not possible to choose the best chiplet for a particular application or workload. The guidelines ... » read more

Chip Industry Technical Paper Roundup: Feb. 19
By Liz Allan - 19 Feb, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=199 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review
By The SE Staff - 16 Feb, 2024 - Comments: 0

By Susan Rambo, Karen Heyman, and Liz Allan. Renesas plans to acquire Altium, maker of PCB design software, for $5.9 billion. In a conference call, Renesas CEO Hidetoshi Shibata cited Altium's PCB design software and digital twin virtual modeling as key components of its future strategy. "I believe it will generate transformational value for our combined customers and our stakeholders," Shib... » read more

HW Security Bug Characteristics in Google’s OpenTitan Silicon Root Of Trust Project 
By Technical Paper Link - 15 Feb, 2024 - Comments: 0

A technical paper titled “An Investigation of Hardware Security Bug Characteristics in Open-Source Projects” was published by researchers at NYU Tandon School of Engineering and University of Calgary. Abstract: "Hardware security is an important concern of system security as vulnerabilities can arise from design errors introduced throughout the development lifecycle. Recent works have pro... » read more

Simulation Of A Kicked Ising Quantum System On The Heavy Hexagon Lattice
By Technical Paper Link - 14 Feb, 2024 - Comments: 0

A technical paper titled “Efficient Tensor Network Simulation of IBM’s Eagle Kicked Ising Experiment” was published by researchers at the Flatiron Institute and New York University. Abstract: "We report an accurate and efficient classical simulation of a kicked Ising quantum system on the heavy hexagon lattice. A simulation of this system was recently performed on a 127-qubit quantum pr... » read more

Chip Industry Week In Review
By The SE Staff - 03 Nov, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, Jesse Allen, and Liz Allan President Biden issued an executive order on the “Safe, Secure, and Trustworthy Development and Use of Artificial Intelligence.” It says entities need to report large-scale computing clusters and the total computing power available, including “any model that was trained using a quantity of computing power greater than 1,026 inte... » read more

A New Architecture And Verification Approach For Hardware Security Modules
By Technical Paper Link - 31 Oct, 2023 - Comments: 0

A technical paper titled “The K2 Architecture for Trustworthy Hardware Security Modules” was published by researchers at MIT Computer Science and Artificial Intelligence Laboratory (CSAIL) and New York University. Abstract: "K2 is a new architecture and verification approach for hardware security modules (HSMs). The K2 architecture's rigid separation between I/O, storage, and computation ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 21 Jul, 2023 - Comments: 0

The Biden-Harris Administration announced the U.S. Cyber Trust Mark, a cybersecurity certification and labeling program to help consumers choose smart devices less vulnerable to cyberattacks. The Federal Communications Commission (FCC) is applying to register the Cyber Trust Mark with the U.S. Patent and Trademark Office and it would appear on qualifying smart products, including refrigerators,... » read more

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