Week In Review: Design, Low Power

By Jesse Allen - 03 Jun, 2022 - Comments: 0

Tools, IP, chips Synopsys unveiled a new data-visibility and machine intelligence-guided design optimization solution. DesignDash is complementary to the company's DSO.ai AI-driven design-space-optimization tool and provides a real-time, unified, 360-degree view of all design activities. It uses deep analytics and machine learning to extract and reveal actionable understanding from large amoun... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 03 Jun, 2022 - Comments: 0

Automotive, mobility Cruise, General Motors’ self-driving car company, obtained a permit to charge for rides in San Francisco, according to a story in Reuters. The California Public Utilities Commission, the regulatory board that can approve permits, voted 4-0 to issue “the first Phase I Driverless Autonomous Vehicle (AV) Passenger Service Deployment permit in California to Cruise LLC to a... » read more

Hardware Attack Surface Widening

By Ed Sperling - 06 Feb, 2020 - Comments: 0

An expanding attack surface in hardware, coupled with increasing complexity inside and outside of chips, is making it far more difficult to secure systems against a variety of new and existing types of attacks. Security experts have been warning about the growing threat for some time, but it is being made worse by the need to gather data from more places and to process it with AI/ML/DL. So e... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: NewAE Technology

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Hardware Attack Surface Widening