By Mark LaPedus
In the mid-1990s, the semiconductor industry embarked on a costly and problematic migration from 200mm to 300mm wafer fabs.
At the time, the 300mm development efforts were in the hands of two groups—Sematech and a Japanese-led entity. The equipment industry was on the outside looking in. And as a result, the migration from 200mm to 300mm fabs was out of sync and a nightma...
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