Week in Review: IoT, Security, Auto

By Jeff Dorsch - 07 Jun, 2019 - Comments: 0

Products/Services Achronix Semiconductor selected the Rambus GDDR6 PHY for its next-generation Speedster7t line of field-programmable gate arrays. The Rambus GDDR6 PHY is used in advanced driver-assistance systems, artificial intelligence, graphics, machine learning, and networking applications. Arm and Marvell Technology Group will work together on design and development of Marvell’s nex... » read more

Week In Review: Design

By Ed Sperling - 28 Dec, 2018 - Comments: 0

Deals eSilicon teamed up with Sunflower Mission once again to present 59 university scholarships for engineering and technology students in Vietnam. Foxconn, the huge Taiwanese contract manufacturer (aka Hon Hai Precision Industry), already announced plans to build a chip plant in Zhuhai, outside of Hong Kong. Now it has developed plans to assemble high-end iPhones in India next year. What'... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 30 Mar, 2018 - Comments: 0

Chipmakers 3D NAND continues to gain steam, but is the industry headed towards a capacity glut in the overall NAND market? Time will tell. In any case, Toshiba is moving forward with its plans to invest in its Fab 6 facility in Japan. The fab will produce the company’s 96-layer 3D NAND devices. Then, Samsung plans to invest $7 billion to double the production capacity for NAND flash memor... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 09 Jun, 2017 - Comments: 0

Market research Earlier this year, the IC and equipment markets were projected to be flat. More recently, though, analysts have raised their forecast, including Pacific Crest Securities. “We are raising our 2017 capex outlook meaningfully, with the upside coming predominantly from Samsung,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. "We're raising our 2017 se... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 06 Nov, 2015 - Comments: 0

China is investing billions of dollars in the IC industry and equipment sectors. The nation is also in the midst of an acquisition and an investment spree, especially in IC packaging. For example, Jiangsu Changjiang Electronics Technology (JCET), a Chinese OSAT, shook up the landscape by recently announcing a deal to acquire STATS ChipPAC for $780 million. The deal was completed in August of 20... » read more

Smartphones Drive Component Sales

By Kenji Tsuda - 09 Dec, 2013 - Comments: 0

The impact of smartphones on electronic components and semiconductors is growing. As reported by the Nihon Keizai Newspaper in October, the total value of orders received in Q3 for six major electronic components set a record. Also, in Taiwan, the overseas orders in September increased to 38.4 billion dollars, which is a 2% increase compared with the same month of the previous year, as reported... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Nikkei

Week in Review: IoT, Security, Auto

Week In Review: Design

The Week In Review: Manufacturing

The Week In Review: Manufacturing

The Week In Review: Manufacturing

Smartphones Drive Component Sales