tag: Nikon

The Week In Review: Manufacturing
By Mark LaPedus - 11 Nov, 2016 - Comments: 1

Fab tools Is Nikon’s semiconductor lithography equipment business on the ropes? Amid losses and dwindling market share, the company has announced a major restructuring plan for this unit. It will reduce fixed costs related to its 193nm immersion scanner business “by headcount rationalization and re-assignments of 1,000 employees,” according to Nikon. In addition, Nikon is reassessing its... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Apr, 2016 - Comments: 0

Fab tool vendors In terms of sales for 2015, Applied Materials retained the No. 1 position in the wafer fab equipment (WFE) market with 1.3% growth last year, according to Garnter. Lam Research experienced the strongest growth of the top 10 vendors in 2015, moving into the No. 2 position. In the rankings, Lam jumped ahead of ASML and TEL. ASML was in third place, followed in order by TEL, KLA-... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 Mar, 2016 - Comments: 0

In a surprising move, Intel is quietly in the process of acquiring IMS Nanofabrication, a developer of multi-beam e-beam tools for mask writing applications, Semiconductor Engineering has learned. With the deal, Intel is moving into uncharted territory by buying a semiconductor equipment company. In the past, though, the chip giant has invested in equipment vendors, such as ASML, Nikon and... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 Feb, 2016 - Comments: 0

The SPIE Advanced Lithography conference is next week. “The conference should provide an update on extreme ultraviolet lithography (EUV) sentiment from chipmakers such as Intel and TSMC, and we expect generally positive sentiment, which should be good for ASML. Still, high-volume adoption timing of EUV appears to be in the 2020 time frame, so it's very early in the process. We expect a lot of... » read more

China’s Fab Tool Biz Heats Up
By Mark LaPedus - 28 Oct, 2015 - Comments: 0

For years, China has been a steady growth market for suppliers of semiconductor equipment. Internally, though, the country is comprised of trailing-edge fabs and IC-assembly houses, which means equipment vendors sell relatively mature tools and compete on price. That’s about to change, however. Today, the IC equipment business is heating up in China as the nation begins to upgrade and pour... » read more

Multiple Lithography Options Still Remain in Play
By Paula Doe - 03 Aug, 2015 - Comments: 1

The throughput and uptime of EUV, and the overlay accuracy of 193nm immersion lithography, continue to steadily improve, though neither is yet ready for 10nm production, according to speakers at SEMICON West. Mike Lercel, ASML director, Product Marketing, reported several EUV tool sites achieved 70 percent uptime for more than a week, and one customer site had done so for more than four ... » read more

Bigger, Brighter TVs
By Mark LaPedus - 24 Jul, 2015 - Comments: 0

The flat panel display (FPD) industry is undergoing a renaissance, with suppliers rolling out a dizzying array of new, high-resolution technologies for mobile devices, computers and TVs. But despite being in the eye of the innovation storm, FPD equipment makers remain cautious—and for good reason. There are a slew of new LCD fabs being built today, mostly in China. This, in turn, is promp... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Jul, 2015 - Comments: 0

Semicon West is always a busy week. Typically, there are a plethora of events going on during the week. It’s also a good week to get a pulse on the industry. The good news: Innovation is alive and well. Bad news: Intel cut its CapEx. And tool makers are in the midst of a lull right now, with a cloudy outlook projected for 2016. Some even see a dreaded downturn next year. Pacific Crest Secu... » read more

Getting Over Overlay
By Mark LaPedus - 18 Jun, 2015 - Comments: 0

Chipmakers continue to migrate to the next node, but there are signs that traditional IC scaling is slowing down. So what’s causing the slowdown? Or for that matter, what could ultimately undo [getkc id="74" comment="Moore's Law"]? It could be a combination of factors. To be sure, IC design costs and complexity are soaring at each node. Scaling challenges are also playing a role. And ov... » read more

10nm Fab Challenges
By Mark LaPedus - 21 May, 2015 - Comments: 1

After a promising start in 2015, the semiconductor equipment industry is currently experiencing a slight lull. The pause is expected to be short-lived, however. Suppliers of [getkc id="208" comment="3D NAND"] devices are expected to add more fab capacity later this year. And about the same time, foundries are expected to order the first wave of high-volume production tools for 10nm. At 10nm... » read more

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