tag: Northeastern University

Do Students Need More Formal Education?

By Brian Bailey - 21 Nov, 2013 - Comments: 0

A few weeks ago, some of the top researchers and practitioners in the area of formal methods converged on Portland, Oregon. The event was the annual Formal Methods in Computer-Aided Design (FMCAD) conference and Semiconductor Engineering attended the panel titled “Teaching Formal Methods: Needs, Challenges, Experiences, and Opportunities.” Panelists included: Jason Baumgartner, formal verif... » read more

Newer posts →

Trending Articles

Chip Industry Week in Review

AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.

by The SE Staff

Three-Way Race To 3D-ICs

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.

Chip Industry Week in Review

EDA export controls; Synopsys-Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE's fan-out bridge; earnings; TSMC's design center; China's legacy chips play; AMD's optical acquisition.

by The SE Staff

Chip Industry Week in Review

China's 3nm chip; state of the industry supply chain; imec's next big push; hyper-dimensional AI chip; OpenAI's $6.5B startup deal; Siemens buys Excellicon; chip revenue challenges; France's new OSAT.

by The SE Staff

Radiation, Temperature, Power Challenges For Chips In Space

Semiconductors designed for spacecraft face a range of extreme conditions that impact aging. A reliable source of power is also needed.

Knowledge Centers
Entities, people and technologies explored

Related Articles

Speeding Up Computational Lithography With The Power And Parallelism Of GPUs

A new lithography library brings mask optimization operations to GPUs.

by Thuc Dam

EUV’s Future Looks Even Brighter

Demand for AI chips is growing exponentially, but costs and complexity limit the technology to a handful of companies. That could soon change.

by Gregory Haley

Startup Funding: Q1 2025

AI chips and data center communications see big funding; 75 startups raise $2 billion.

by Jesse Allen

Chip Industry Week in Review

AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.

by The SE Staff

Advanced Packaging Fundamentals for Semiconductor Engineers

New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.

by Bryon Moyer

Linear Pluggable Optics Save Energy In Data Centers

New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.

by Bryon Moyer

Interconnects Approach Tipping Point

The 10 angstrom node will usher in new architectures, tooling, and materials, forcing a massive change in the way fabs build interconnects.

by Laura Peters

Optimization of Oxygen Plasma Conditions for Cu-Cu Bonding

by Technical Paper Link

About

Navigation

Connect With Us

Facebook
Twitter @semiEngineering
LinkedIn
YouTube

Copyright ©2013-2025 SMG | Terms of Service | Privacy Policy