Manufacturing Bits: Oct. 9

By Mark LaPedus - 09 Oct, 2019 - Comments: 0

World’s strongest silver A group has developed what researchers say is the world’s strongest silver. The silver demonstrated a hardness of 3.05 GPa, which is 42% stronger than the previous world record. The University of Vermont, Lawrence Livermore National Lab, the Ames Laboratory, Los Alamos National Laboratory and UCLA contributed to the work. Silver is an element with high electr... » read more

Manufacturing Bits: Dec. 26

By Mark LaPedus - 26 Dec, 2018 - Comments: 0

Polymer pen litho Using a polymer pen lithography technique, the Air Force Research Laboratory and Northwestern University have developed a quick way to discover new materials. Researchers have developed a combinatorial library of tiny nanoparticles on a substrate. A combinatorial library, sometimes referred to as a megalibrary, is a collection of different structures. Each structure is enc... » read more

Manufacturing Bits: March 7

By Mark LaPedus - 07 Mar, 2017 - Comments: 0

Materials database Electronic materials and nanocrystals are used in a variety of applications. To integrate materials and crystals in devices, researchers must search in multiple places to discover new technologies and their various properties. On top of that, researchers may require long hours in the lab, and large computational resources, to enable new materials. Seeking to help res... » read more

Manufacturing Bits: Feb. 3

By Mark LaPedus - 03 Feb, 2015 - Comments: 0

Robotic plants In 2012, the European Commission launched the so-called Plantoid project. In the project, researchers hope to devise synthetic robotic plants. Inspired by plant roots, the robots could be used for soil monitoring and other applications. The group is devising so-called artifacts. These components resemble plants and plant roots. The new technologies expected to result from the... » read more

Manufacturing Bits: Jan. 13

By Mark LaPedus - 13 Jan, 2015 - Comments: 0

Pop-up 3D printing Northwestern University and the University of Illinois at Urbana-Champaign have developed a new “pop-up” printing technique to make 3D structures down to 100nm. The technique has advantages over today’s 3D printing, which is creating a lot of buzz, if not hype, in the market. Researchers from Northwestern and Illinois devised a printing technique that mimics the act... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Northwestern

Manufacturing Bits: Oct. 9

Manufacturing Bits: Dec. 26

Manufacturing Bits: March 7

Manufacturing Bits: Feb. 3

Manufacturing Bits: Jan. 13

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