The Good And Bad Of Bi-Directional Charging

By Marie C. Baca and Ed Sperling - 11 Jan, 2023 - Comments: 2

Auto OEMs are starting to offer bi-directional charging in EVs, allowing batteries to power homes during outages or wherever else it is needed, and to smooth out any hiccups in the grid. But this technology also can shorten the lifetime of batteries, and it can open the door to more cyberattacks. The idea behind bi-directional charging is simple enough. EVs can store huge amounts of power, a... » read more

Always-On Energy Challenges

By Ed Sperling - 14 May, 2015 - Comments: 0

The roar over the Internet of Things these days is almost deafening. Inside of China, everything being made for the domestic market is smart-ready. And companies ranging from watchmakers to appliances to automotive manufacturers are building connectivity into everything. The problem is that in order for it to work as planned—to communicate with other devices and send alerts to consumers or... » read more

Dark Data

By Ed Sperling - 12 Mar, 2015 - Comments: 0

Last month the National Resources Defense Council updated its study on data centers. The numbers themselves are rather mind boggling, and the NRDC has done an exceptional job over the years in ferreting out the biggest, baddest culprits of wasted energy. Witness the 2011 report on set-top boxes, which is finally beginning to yield changes in set-top box designs. The data center report is eq... » read more

Putting Energy In Perspective

By Ed Sperling - 22 Nov, 2013 - Comments: 0

The resurgent interest in 2.5D stacked die, the introduction of ultra-low-power memory and the relentless focus on low power for the Internet of Things are rather predictable progressions to engineers working in the semiconductor industry. What’s less obvious is how these changes are filtering out into the rest of the market and where it needs to go next. While many people have been talkin... » read more

Machine Talk

By Ed Sperling - 03 May, 2013 - Comments: 0

The Internet of Things raises some interesting questions that have never been fully addressed in semiconductor design. For instance, how do you assess the necessary performance for any particular thing? And how long is another thing willing to wait for information to be passed along? These sound like fairly basic engineering questions—until you consider that the Internet of Things is actua... » read more

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Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: NRDC

The Good And Bad Of Bi-Directional Charging

Always-On Energy Challenges

Dark Data

Putting Energy In Perspective

Machine Talk

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