Manufacturing Bits: Oct. 6

By Mark LaPedus - 06 Oct, 2015 - Comments: 0

Magnetic mass spectrometers The National High Magnetic Field Laboratory (National MagLab) has developed a mass spectrometer, based on what the organization claims is the world’s highest field superconducting magnet. The instrument from National MagLab is called a Fourier transform ion cyclotron resonance (FT-ICR) mass spectrometer. The mass spectrometer boasts a 21 tesla magnet, which is ... » read more

Manufacturing Bits: Sept. 22

By Mark LaPedus - 22 Sep, 2015 - Comments: 0

Superconductor puddles Superconductors are devices that have zero electrical resistance, making them attractive for a range of applications. But superconductors must be cooled down to temperatures near zero to work, which, in turn, limits their applications. High-temperature superconductors are more promising technologies, but once again, they must be cooled down to function. The industr... » read more

Manufacturing Bits: August 25

By Mark LaPedus - 25 Aug, 2015 - Comments: 0

South Pole neutrinos A group of researchers using an instrument buried deep in the ice at the South Pole have announced a new observation of high-energy neutrinos from beyond our solar system and the galaxy. The IceCube Neutrino Observatory, a cubic-kilometer-sized detector sunk into the ice sheet at the South Pole, allows researchers to see the byproducts of neutrino interactions with the ... » read more

Manufacturing Bits: August 11

By Mark LaPedus - 11 Aug, 2015 - Comments: 0

World neutrino record The U.S. Department of Energy’s Fermi National Accelerator Laboratory has achieved a world record for high-energy neutrino experiments. In one neutrino experiment, researchers sustained a 521-kilowatt beam generated by the organization’s so-called Main Injector particle accelerator. The previous record was a 400-plus-kilowatt beam, which was accomplished at CERN. ... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 22 May, 2015 - Comments: 0

At an event, Samsung rolled out its 10nm finFET technology. The company also showed a 300mm wafer with 10nm finFET transistors. "We have silicon-based PDKs out," said Kelvin Low, senior director of foundry marketing for Samsung. Samsung plans to move into production with its 10nm finFET technology by the end of 2016, he said. IC Insights released its chip rankings in terms of sales in the fi... » read more

Manufacturing Bits: April 28

By Mark LaPedus - 28 Apr, 2015 - Comments: 0

CIA and 3D printers Voxel8, a supplier of 3D printers, has closed a strategic investment and technology development agreement with In-Q-Tel (IQT), the venture capital arm of the U.S. Central Intelligence Agency (CIA). Voxel8, founded by technologists from Harvard University, is commercializing a new platform for 3D printing. The company enables engineers to create products with embedded 3D ... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 26 Sep, 2014 - Comments: 0

Is the sky falling on the ATE market? The ATE market is expected to hit $2.8 billion in 2014, up from $2.28 billion in 2013, according to Pacific Crest Securities. “Overall, we are now modeling overall semiconductor test demand to decline by 2% in 2015, a significant change from our previous estimate of up 10%,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. “Te... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Manufacturing Bits: Oct. 6

Manufacturing Bits: Sept. 22

Manufacturing Bits: August 25

Manufacturing Bits: August 11

The Week In Review: Manufacturing

Manufacturing Bits: April 28

The Week In Review: Manufacturing